Hot air solder leveling
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Template:More sources needed Script error: No such module "redirect hatnote". HASL or HAL (for hot air (solder) leveling) is a type of finish used on printed circuit boards (PCBs).
The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. Excess solder is removed by passing the PCB between hot air knives.[1]
HASL can be applied with or without lead (Pb), but only lead-free HASL is RoHS compliant.
Advantages of HASL
- Excellent wetting during component soldering.
- Avoids copper corrosion.
Disadvantages of HASL
- Low planarity on vertical levelers may make this surface finish unsuitable for use with fine pitch components. Improved planarity can be achieved using a horizontal leveler.
- High thermal stress during the process may introduce defects into PCB.
See also
- Electroless Nickel Immersion Gold (ENIG)
- Immersion Silver (IAg)
- Organic Solderability Preservative (OSP)
- Reflow soldering
- Wave soldering
References
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