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....ieee.org/advanced-chip-packaging-satisfies-smartphone-needs Advanced Chip Packaging Satisfies Smartphone Needs].” February 8, 2011. Retrieved July 31, 2015.</r ...7E7EA1-BD30-4DA4-BD615FEA1A7F5AE9/3D%20Packaging%20Report%20071805.pdf 3-D Packaging: A Technology Review].” June 23, 2005. Retrieved July 31, 2015.</ref> ...

'''Integrated circuit packaging''' is the final stage of [[fabrication (semiconductor)|semiconductor device The packaging stage is followed by testing of the integrated circuit. ...

...have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering. Electronic packaging can be organized by levels: ...

...) or other [[semiconductor device]] and its [[integrated circuit packaging|packaging]] during [[Fabrication (semiconductor)|semiconductor device fabrication]]. ...e issues that must be considered.<ref name="ieeexplore.ieee.org"/> Special packaging is required in order to protect copper wire and achieve a longer shelf life ...

...nners, and other kinds of non-optical techniques are used for high speed [[microfabrication]] of microstructures, but in case of MPL, some of these become redundant. ...imately 200&nbsp;nm or greater. Direct laser writing for microelectronics packaging, 3D electronics and heterogeneous integration were developed in 1995 at the ...

...ugh-silicon vias ([[Through-silicon via|TSVs]]) in advanced 3D wafer level packaging technology. [[Category:Etching (microfabrication)]] ...

...n wafer, before [[wafer dicing|dicing]] and [[Integrated circuit packaging|packaging]]. ...l microcircuits are separated by [[wafer dicing]] and [[Integrated circuit packaging|packaged]] as an integrated circuit. ...

...thick photoresist and/or double-sided alignment and exposure. Advanced 3D packaging, optical devices, and micro-electromechanical systems (MEMS) applications f ...may then be permanently transferred into the substrate via any number of [[microfabrication]] processes, such as [[etching]] or [[lift-off (microtechnology)|lift-off]] ...

...from [[isotope]]s in [[Soft error#Alpha particles from package decay|chip packaging materials]], [[cosmic radiation]] for spacecraft and high-altitude aircraft ...e the DRAM data bits. These effects have been reduced today by using purer packaging materials, and employing [[error-correcting code]]s to detect and often cor ...

...rst3=Rao |date=2012-04-06 |title=Die singulation technologies for advanced packaging: A critical review |url=https://doi.org/10.1116/1.3700230 |journal=Journal ...=PA8 | title=Fundamental Principles of Optical Lithography: The Science of Microfabrication | isbn=978-0-470-72386-9 | last1=Mack | first1=Chris | date=11 March 2008 | ...

The following table<ref>{{cite book |title=Fundamentals of Microfabrication |last=Madou |first=Marc |publisher=CRC Press |isbn=978-0-8493-0826-0 |date= ...to remove the copper-clad substrate.<ref>{{cite book |title=The Electronic Packaging Handbook |last=Montrose |first=Mark I |publisher=CRC Press |year=1999}}</re ...

...=1983SciAm.248d..44A}}</ref> These include molding and plating, [[Etching (microfabrication)|wet etching]] ([[Potassium hydroxide|KOH]], [[Tetramethylammonium hydroxid ...cCord MA, Rooks MJ|title=Handbook of Microlithography, Micromachining, and Microfabrication. Volume 1: Microlithography|publisher=[[SPIE]]|year=1997|isbn=978-0-8194-97 ...

...moisture. [[Printed circuit board|Printed wiring]] methods and [[Etching (microfabrication)|etching techniques]] were explored, and their use encouraged in radar equi ...for his participation by transatlantic telephone in the Electronic Circuit Packaging Symposium at the University of Colorado (1964). ...

...t2=A. S.|title=The effect on turkey meat shelf life of modified-atmosphere packaging with an argon mixture|journal=Poultry Science|volume=88|issue=9|year=2009|p Argon is used to displace oxygen- and moisture-containing air in packaging material to extend the shelf-lives of the contents (argon has the [[E numbe ...

...[[top-down and bottom-up design|top-down]] approach uses the traditional [[microfabrication]] methods, i.e. [[photolithography|optical]], [[electron-beam lithography]] ...were also gauged in this study. With good aging stability and appropriate packaging, the degradation rate of PDMS in response to heat, light, and radiation can ...

...tubing is used as the feedstock for the production of [[parenteral]] drug packaging, such as vials and pre-filled [[syringe]]s, as well as [[ampoule]]s and [[D ...[[microelectromechanical systems]] (MEMS), as part of stacks of [[Etching (microfabrication)|etched]] silicon [[Wafer (electronics)|wafers]] bonded to the etched boros ...

.../2005/07/wire-bond-vs-flip-chip-packaging/ | title=Wire Bond Vs. Flip Chip Packaging &#124; Semiconductor Digest | date=10 December 2016 }}</ref> ...aphy]], deposition (such as [[chemical vapor deposition]]), and [[Etching (microfabrication)|etching]]. The main process steps are supplemented by doping and cleaning. ...

...ge=29}}</ref> The Romans perfected [[cameo glass]], produced by [[Etching (microfabrication)|etching]] and carving through fused layers of different colours to produce === Packaging === ...

...avamudhan |first=Shyam |title=Development of Micro/Nanosensor elements and packaging techniques for oceanography |url=https://digitalcommons.usf.edu/etd/607/ |y ...r phase.<ref name=":4">{{Citation |last1=Quero |first1=José M. |title=11 - Microfabrication technologies used for creating smart devices for industrial applications |d ...

...als [[metrology]] and synthesis, which have been developed in support of [[microfabrication]] research. Materials with structure at the nanoscale often have unique opt ...e:Expanded polystyrene foam dunnage.jpg|thumb|Expanded polystyrene polymer packaging]] ...