Intermetallic: Difference between revisions
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{{Short description|Type of metallic alloy}} | {{Short description|Type of metallic alloy}} | ||
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[[File:Cr11Ge19 crystals.jpg|thumb|right|255px|{{center| Cr<sub>11</sub>Ge<sub>19</sub> }}]] | [[File:Cr11Ge19 crystals.jpg|thumb|right|255px|{{center| Cr<sub>11</sub>Ge<sub>19</sub> }}]] | ||
An '''intermetallic''' | An '''intermetallic''' is a type of [[metallic bonding|metallic]] [[alloy]] that forms an ordered solid-state [[Chemical compound|compound]] between two or more metallic elements. Alternatively, it can be called '''intermetallic compound''', '''intermetallic alloy''', '''ordered intermetallic alloy''', or '''long-range-ordered alloy'''. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties.<ref name=":0">{{Cite book|last1=Askeland|first1=Donald R.|last2=Wright|first2=Wendelin J.|author2-link=Wendelin Wright|title=The science and engineering of materials|isbn=978-1-305-07676-1|edition=Seventh|location=Boston, MA|pages=387–389|chapter=11-2 Intermetallic Compounds|date=January 2015|oclc=903959750}}</ref><ref>{{Cite book|last=Panel On Intermetallic Alloy Development, Commission On Engineering And Technical Systems|title=Intermetallic alloy development : a program evaluation|date=1997|publisher=National Academies Press|isbn=0-309-52438-5|pages=10|oclc=906692179}}</ref><ref>{{Cite book|last=Soboyejo|first= W. O.|title=Mechanical properties of engineered materials|date=2003|publisher=Marcel Dekker|isbn=0-8247-8900-8|chapter=1.4.3 Intermetallics|oclc=300921090}}</ref> They can be classified as [[Stoichiometry|stoichiometric]] or [[Non-stoichiometric compound|nonstoichiometic]].<ref name=":0" /> | ||
The term "intermetallic compounds" applied to solid phases has long been in use. However, [[William Hume-Rothery|Hume-Rothery]] argued that it misleads, suggesting a fixed stoichiometry and a clear decomposition into [[species (chemistry)|species]].<ref>{{cite book|title=Electrons, atoms, metals and alloys|first=W.|last=Hume-Rothery|publisher=Louis Cassier Co., Ltd|location=London|orig-date=1948|year=1955|edition=revised|pages=316–317|url=https://archive.org/details/in.ernet.dli.2015.18295|via=the [[Internet Archive]]}}</ref> | The term "intermetallic compounds" applied to solid phases has long been in use. However, [[William Hume-Rothery|Hume-Rothery]] argued that it misleads, suggesting a fixed stoichiometry and a clear decomposition into [[species (chemistry)|species]].<ref>{{cite book|title=Electrons, atoms, metals and alloys|first=W.|last=Hume-Rothery|publisher=Louis Cassier Co., Ltd|location=London|orig-date=1948|year=1955|edition=revised|pages=316–317|url=https://archive.org/details/in.ernet.dli.2015.18295|via=the [[Internet Archive]]}}</ref> | ||
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In 1967 {{interlanguage link|Gustav Ernst Robert Schulze|de}} defined intermetallic compounds as ''solid phases containing two or more metallic elements, with optionally one or more non-metallic elements, whose crystal structure differs from that of the other constituents''.<ref>G. E. R. Schulze: Metallphysik, Akademie-Verlag, Berlin 1967</ref> This definition includes: | In 1967 {{interlanguage link|Gustav Ernst Robert Schulze|de}} defined intermetallic compounds as ''solid phases containing two or more metallic elements, with optionally one or more non-metallic elements, whose crystal structure differs from that of the other constituents''.<ref>G. E. R. Schulze: Metallphysik, Akademie-Verlag, Berlin 1967</ref> This definition includes: | ||
* Electron (or [[Hume-Rothery rules|Hume-Rothery]]) compounds | * Electron (or [[Hume-Rothery rules|Hume-Rothery]]) compounds | ||
* Size packing phases. e.g. [[Laves phase]]s, [[Frank–Kasper phases]] and [[Nowotny phase]]s | * Size packing phases. e.g., [[Laves phase]]s, [[Frank–Kasper phases]]<ref>{{cite journal |last1=Frank |first1=F. C. |last2=Kasper |first2=J. S. |title=Complex alloy structures regarded as sphere packings. I. Definitions and basic principles |journal=Acta Crystallographica |date=10 March 1958 |volume=11 |issue=3 |pages=184–190 |doi=10.1107/S0365110X58000487 |bibcode=1958AcCry..11..184F }}</ref> and [[Nowotny phase]]s | ||
* [[Zintl phase]]s | * [[Zintl phase]]s | ||
The definition of metal includes:{{ | The definition of metal includes:{{citation needed|date=March 2025}} | ||
* [[Post-transition metal]]s, i.e. [[aluminium]], [[gallium]], [[indium]], [[thallium]], [[tin]], [[lead]], and [[bismuth]]. | * [[Post-transition metal]]s, i.e. [[aluminium]], [[gallium]], [[indium]], [[thallium]], [[tin]], [[lead]], and [[bismuth]]. | ||
* [[Metalloid]]s, e.g. [[silicon]], [[germanium]], [[arsenic]], [[antimony]] and [[tellurium]]. | * [[Metalloid]]s, e.g., [[silicon]], [[germanium]], [[arsenic]], [[antimony]] and [[tellurium]]. | ||
Homogeneous and heterogeneous [[solid solution]]s of metals, and [[interstitial compound]]s such as [[carbide]]s and [[nitride]]s are excluded under this definition. However, interstitial intermetallic compounds are included, as are alloys of intermetallic compounds with a metal.{{ | Homogeneous and heterogeneous [[solid solution]]s of metals, and [[interstitial compound]]s such as [[carbide]]s and [[nitride]]s are excluded under this definition. However, interstitial intermetallic compounds are included, as are alloys of intermetallic compounds with a metal.{{citation needed|date=March 2025}} | ||
===Common use=== | ===Common use=== | ||
In common use, the research definition, including [[post-transition metal]]s and [[metalloid]]s, is extended to include compounds such as [[cementite]], Fe<sub>3</sub>C. These compounds, sometimes termed [[interstitial compound]]s, can be [[stoichiometric]], and share properties with the above intermetallic compounds.{{ | In common use, the research definition, including [[post-transition metal]]s and [[metalloid]]s, is extended to include compounds such as [[cementite]], Fe<sub>3</sub>C. These compounds, sometimes termed [[interstitial compound]]s, can be [[stoichiometric]], and share properties with the above intermetallic compounds.{{citation needed|date=January 2024}} | ||
===Complexes=== | ===Complexes=== | ||
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===B2=== | ===B2=== | ||
A [[Strukturbericht designation#B-compounds|B2]] intermetallic compound has equal numbers of atoms of two metals such as | [[File:Al-Ni (B2 structure).png|thumb|[[Nickel aluminide|Al-Ni]] B2 structure (lattice parameter: 2.86 A) viewed from [100], [110], [111], and [112] directions.]] | ||
A [[Strukturbericht designation#B-compounds|B2]] (also known as cesium chloride structure type) intermetallic compound has equal numbers of atoms of two metals, such as aluminium-iron, and [[Nickel aluminide|aluminium-nickel]], arranged as two interpenetrating simple cubic lattices of the component metals.<ref>{{cite news|title=Wings of steel: An alloy of iron and aluminium is as good as titanium, at a tenth of the cost|url=https://www.economist.com/news/science-and-technology/21642107-alloy-iron-and-aluminium-good-titanium-tenth|access-date=5 February 2015|newspaper=The Economist|date=7 February 2015|quote=E02715}}</ref> | |||
==Properties== | ==Properties== | ||
Intermetallic compounds are generally brittle at room temperature and have high melting | Intermetallic compounds are generally brittle at room temperature and have high [[melting point]], though many also exhibit metallic conductivity or semiconducting behavior depending on the degree of covalent bonding. Cleavage or intergranular fracture modes are typical of intermetallics due to limited independent [[Slip (materials science)|slip]] systems required for plastic deformation. However, some intermetallics have ductile fracture modes such as Nb–15Al–40Ti. Others can exhibit improved [[ductility]] by alloying with other elements to increase grain boundary cohesion. Alloying of other materials such as [[boron]] to improve grain boundary cohesion can improve ductility.<ref>{{Cite book|last=Soboyejo|first= W. O.|title=Mechanical properties of engineered materials|date=2003|publisher=Marcel Dekker|isbn=0-8247-8900-8|chapter=12.5 Fracture of Intermetallics|oclc=300921090}}</ref> They may offer a compromise between [[ceramic]] and metallic properties when hardness and/or resistance to high temperatures is important enough to sacrifice some [[toughness]] and ease of processing. They can display desirable [[magnetism|magnetic]] and chemical properties, due to their strong internal order and mixed ([[metallic bond|metallic]] and [[covalent bond|covalent]]/[[ionic bond|ionic]]) bonding, respectively. Intermetallics have given rise to various novel materials developments.{{citation needed|date=March 2025}} | ||
{| class="wikitable" | {| class="wikitable" | ||
|+Physical properties of intermetallics<ref name=":0" /> | |+Physical properties of intermetallics<ref name=":0" /> | ||
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== Applications == | == Applications == | ||
Examples include [[alnico]] and the [[hydrogen storage]] materials in [[nickel metal hydride]] batteries. [[Nickel aluminide|Ni<sub>3</sub>Al]], which is the hardening phase in the familiar nickel-base [[superalloy|super alloy]]s, and the various [[titanium]] aluminides have attracted interest for [[turbine blade]] applications, while the latter is also used in small quantities for [[grain refinement]] of [[titanium alloy]]s. [[Silicide]]s, intermetallics involving silicon, serve as barrier and contact layers in [[microelectronics]].<ref>{{Cite journal |date=June 1993 |title=Metallization: theory and practice for VLSI and ULSI |journal=Choice Reviews Online |volume=30 |issue=10 |pages= | Examples include [[alnico]] and the [[hydrogen storage]] materials in [[nickel metal hydride]] batteries. [[Nickel aluminide|Ni<sub>3</sub>Al]], which is the hardening phase in the familiar nickel-base [[superalloy|super alloy]]s, and the various [[titanium]] aluminides have attracted interest for [[turbine blade]] applications, while the latter is also used in small quantities for [[grain refinement]] of [[titanium alloy]]s. [[Silicide]]s, intermetallics involving silicon, serve as barrier and contact layers in [[microelectronics]].<ref>{{Cite journal |date=June 1993 |title=Metallization: theory and practice for VLSI and ULSI |journal=Choice Reviews Online |volume=30 |issue=10 |pages=30–5612–30-5612 |doi=10.5860/choice.30-5612 |issn=0009-4978|first=S.P. |last=Murarka |doi-broken-date=1 July 2025 }}</ref> Others include: | ||
* [[Magnetic material]]s e.g. [[alnico]], [[sendust]], Permendur, FeCo, [[Terfenol-D]] | * [[Magnetic material]]s e.g., [[alnico]], [[sendust]], Permendur, FeCo, [[Terfenol-D]] | ||
* [[Superconductors]] e.g. [[A15 phases]], [[niobium-tin]] | * [[Superconductors]] e.g., [[A15 phases]], [[niobium-tin]] | ||
* [[Hydrogen storage]] e.g. AB<sub>5</sub> compounds ([[nickel metal hydride batteries]]) | * [[Hydrogen storage]] e.g., AB<sub>5</sub> compounds ([[nickel metal hydride batteries]]) | ||
* [[Shape memory alloy]]s e.g. Cu-Al-Ni (alloys of Cu<sub>3</sub>Al and nickel), [[Nitinol]] (NiTi) | * [[Shape memory alloy]]s e.g., Cu-Al-Ni (alloys of Cu<sub>3</sub>Al and nickel), [[Nitinol]] (NiTi) | ||
* Coating materials e.g. NiAl | * Coating materials e.g., NiAl | ||
* High-temperature [[structural materials]] e.g. [[nickel aluminide]], Ni<sub>3</sub>Al | * High-temperature [[structural materials]] e.g., [[nickel aluminide]], Ni<sub>3</sub>Al | ||
* [[Dental amalgam]]s, which are alloys of intermetallics Ag<sub>3</sub>Sn and Cu<sub>3</sub>Sn | * [[Dental amalgam]]s, which are alloys of intermetallics Ag<sub>3</sub>Sn and Cu<sub>3</sub>Sn | ||
* [[Semiconductor device|Gate contact]]/ [[barrier layer]] for [[microelectronics]] e.g. [[Titanium disilicide|TiSi<sub>2</sub>]]<ref>{{cite book | * [[Semiconductor device|Gate contact]]/ [[barrier layer]] for [[microelectronics]] e.g., [[Titanium disilicide|TiSi<sub>2</sub>]]<ref>{{cite book | ||
| last = Ohring | first = Milton | title = Materials Science of Thin Films | publisher = Academic Press | year = 2002 | isbn = 9780125249751 | url = {{google books|plainurl=y|id=50jZ8a3_hZgC}} }}</ref>{{rp| 692}} | | last = Ohring | first = Milton | title = Materials Science of Thin Films | publisher = Academic Press | year = 2002 | isbn = 9780125249751 | url = {{google books|plainurl=y|id=50jZ8a3_hZgC}} }}</ref>{{rp| 692}} | ||
* [[Laves phase]]s (AB<sub>2</sub>), e.g., MgCu<sub>2</sub>, MgZn<sub>2</sub> and MgNi<sub>2</sub>. | * [[Laves phase]]s (AB<sub>2</sub>), e.g., MgCu<sub>2</sub>, MgZn<sub>2</sub> and MgNi<sub>2</sub>. | ||
The unintended formation of intermetallics can cause problems. For example, [[Gold-aluminium intermetallic|intermetallics of gold and aluminium]] can be a significant cause of [[wire bonding|wire bond]] failures in [[semiconductor device]]s and other [[microelectronics]] devices. The management of intermetallics is a major issue in the reliability of [[solder]] joints between electronic components.{{ | The unintended formation of intermetallics can cause problems. For example, [[Gold-aluminium intermetallic|intermetallics of gold and aluminium]] can be a significant cause of [[wire bonding|wire bond]] failures in [[semiconductor device]]s and other [[microelectronics]] devices. The management of intermetallics is a major issue in the reliability of [[solder]] joints between electronic components.{{citation needed|date=January 2024}} | ||
==Intermetallic particles== | ==Intermetallic particles== | ||
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* Chinese high tin [[bronze]], Cu<sub>31</sub>Sn<sub>8</sub> | * Chinese high tin [[bronze]], Cu<sub>31</sub>Sn<sub>8</sub> | ||
* [[Type metal]], SbSn | * [[Type metal]], SbSn | ||
* Chinese [[Cupronickel|white copper]], CuNi <ref>{{cite web|url=http://www.chinatoday.com.cn/English/e20026/sunzi1.htm|title=The Art of War by Sun Zi: A Book for All Times|publisher=[[China Today]]|access-date=2022 | * Chinese [[Cupronickel|white copper]], CuNi <ref>{{cite web|url=http://www.chinatoday.com.cn/English/e20026/sunzi1.htm|title=The Art of War by Sun Zi: A Book for All Times|publisher=[[China Today]]|access-date=25 November 2022|archive-date=7 March 2005|archive-url=https://web.archive.org/web/20050307083704/http://www.chinatoday.com.cn/English/e20026/sunzi1.htm|url-status=dead}}</ref> | ||
German type metal is described as breaking like glass, without bending, softer than copper, but more fusible than lead.<ref>{{Cite book |first=George |last=Long |url={{google books|plainurl=y|id=joN6G1T6ZHIC}}|title=The Penny Cyclopædia of the Society for the Diffusion of Useful Knowledge |chapter=Type-pounding|date=1843 |publisher=C. Knight |language=en}}</ref>{{rp|454}} The chemical formula does not agree with the one above; however, the properties match with an intermetallic compound or an alloy of one.{{ | German type metal is described as breaking like glass, without bending, softer than copper, but more fusible than lead.<ref>{{Cite book |first=George |last=Long |url={{google books|plainurl=y|id=joN6G1T6ZHIC}}|title=The Penny Cyclopædia of the Society for the Diffusion of Useful Knowledge |chapter=Type-pounding|date=1843 |publisher=C. Knight |language=en}}</ref>{{rp|454}} The chemical formula does not agree with the one above; however, the properties match with an intermetallic compound or an alloy of one.{{citation needed|date=January 2024}} | ||
==See also== | ==See also== | ||
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* [[Metallurgy]] | * [[Metallurgy]] | ||
* [[Solid solution]] | * [[Solid solution]] | ||
* [[Strukturbericht designation]] | |||
* [[Order and disorder]] | |||
==References== | ==References== | ||
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==External links== | ==External links== | ||
* [http://www.elsevier.com/wps/find/journaldescription.cws_home/423924/description#description ''Intermetallics''], scientific journal | * [http://www.elsevier.com/wps/find/journaldescription.cws_home/423924/description#description ''Intermetallics''], scientific journal | ||
* {{cite web|url=http://nepp.nasa.gov/wirebond/intermetallic_creation_and_growt.htm|archive-url=https://web.archive.org/web/20051218202657/http://nepp.nasa.gov/wirebond/intermetallic_creation_and_growt.htm |archive-date=December | * {{cite web|url=http://nepp.nasa.gov/wirebond/intermetallic_creation_and_growt.htm|archive-url=https://web.archive.org/web/20051218202657/http://nepp.nasa.gov/wirebond/intermetallic_creation_and_growt.htm |archive-date=18 December 2005 |title=Intermetallic Creation and Growth}} | ||
* {{Cite web |title=IMPRESS Intermetallics project |url=http://www.spaceflight.esa.int/impress#IMPRESS |access-date=2024 | * {{Cite web |title=IMPRESS Intermetallics project |url=http://www.spaceflight.esa.int/impress#IMPRESS |access-date=22 December 2024 |website=www.spaceflight.esa.int | ||
|archive-url=https://web.archive.org/web/20070329034903/http://www.spaceflight.esa.int/impress/#IMPRESS |archive-date=2007 | |archive-url=https://web.archive.org/web/20070329034903/http://www.spaceflight.esa.int/impress/#IMPRESS |archive-date=29 March 2007 }} | ||
* {{cite AV media|url=https://www.ameslab.gov/mpc/video |archive-url=https://web.archive.org/web/20151210223620/https://www.ameslab.gov/mpc/video |archive-date=December | * {{cite AV media|url=https://www.ameslab.gov/mpc/video |archive-url=https://web.archive.org/web/20151210223620/https://www.ameslab.gov/mpc/video |archive-date=10 December 2015|title=Video of an AB<sub>5</sub> intermetallic compound solidifying/freezing}} | ||
{{Authority control}} | {{Authority control}} | ||
[[Category:Intermetallics| ]] | [[Category:Intermetallics| ]] | ||
Latest revision as of 18:24, 23 November 2025
Template:Short description Template:Use dmy dates
An intermetallic is a type of metallic alloy that forms an ordered solid-state compound between two or more metallic elements. Alternatively, it can be called intermetallic compound, intermetallic alloy, ordered intermetallic alloy, or long-range-ordered alloy. Intermetallics are generally hard and brittle, with good high-temperature mechanical properties.[1][2][3] They can be classified as stoichiometric or nonstoichiometic.[1]
The term "intermetallic compounds" applied to solid phases has long been in use. However, Hume-Rothery argued that it misleads, suggesting a fixed stoichiometry and a clear decomposition into species.[4]
Definitions
Research definition
In 1967 Template:Interlanguage link defined intermetallic compounds as solid phases containing two or more metallic elements, with optionally one or more non-metallic elements, whose crystal structure differs from that of the other constituents.[5] This definition includes:
- Electron (or Hume-Rothery) compounds
- Size packing phases. e.g., Laves phases, Frank–Kasper phases[6] and Nowotny phases
- Zintl phases
The definition of metal includes:Script error: No such module "Unsubst".
- Post-transition metals, i.e. aluminium, gallium, indium, thallium, tin, lead, and bismuth.
- Metalloids, e.g., silicon, germanium, arsenic, antimony and tellurium.
Homogeneous and heterogeneous solid solutions of metals, and interstitial compounds such as carbides and nitrides are excluded under this definition. However, interstitial intermetallic compounds are included, as are alloys of intermetallic compounds with a metal.Script error: No such module "Unsubst".
Common use
In common use, the research definition, including post-transition metals and metalloids, is extended to include compounds such as cementite, Fe3C. These compounds, sometimes termed interstitial compounds, can be stoichiometric, and share properties with the above intermetallic compounds.Script error: No such module "Unsubst".
Complexes
The term intermetallic is used[7] to describe compounds involving two or more metals such as the cyclopentadienyl complex Cp6Ni2Zn4.
B2
A B2 (also known as cesium chloride structure type) intermetallic compound has equal numbers of atoms of two metals, such as aluminium-iron, and aluminium-nickel, arranged as two interpenetrating simple cubic lattices of the component metals.[8]
Properties
Intermetallic compounds are generally brittle at room temperature and have high melting point, though many also exhibit metallic conductivity or semiconducting behavior depending on the degree of covalent bonding. Cleavage or intergranular fracture modes are typical of intermetallics due to limited independent slip systems required for plastic deformation. However, some intermetallics have ductile fracture modes such as Nb–15Al–40Ti. Others can exhibit improved ductility by alloying with other elements to increase grain boundary cohesion. Alloying of other materials such as boron to improve grain boundary cohesion can improve ductility.[9] They may offer a compromise between ceramic and metallic properties when hardness and/or resistance to high temperatures is important enough to sacrifice some toughness and ease of processing. They can display desirable magnetic and chemical properties, due to their strong internal order and mixed (metallic and covalent/ionic) bonding, respectively. Intermetallics have given rise to various novel materials developments.Script error: No such module "Unsubst".
| Intermetallic Compound | Melting Temperature
(°C) |
Density
(kg/m3) |
Young's Modulus (GPa) |
|---|---|---|---|
| FeAl | 1250–1400 | 5600 | 263 |
| Ti3Al | 1600 | 4200 | 210 |
| MoSi2 | 2020 | 6310 | 430 |
Applications
Examples include alnico and the hydrogen storage materials in nickel metal hydride batteries. Ni3Al, which is the hardening phase in the familiar nickel-base super alloys, and the various titanium aluminides have attracted interest for turbine blade applications, while the latter is also used in small quantities for grain refinement of titanium alloys. Silicides, intermetallics involving silicon, serve as barrier and contact layers in microelectronics.[10] Others include:
- Magnetic materials e.g., alnico, sendust, Permendur, FeCo, Terfenol-D
- Superconductors e.g., A15 phases, niobium-tin
- Hydrogen storage e.g., AB5 compounds (nickel metal hydride batteries)
- Shape memory alloys e.g., Cu-Al-Ni (alloys of Cu3Al and nickel), Nitinol (NiTi)
- Coating materials e.g., NiAl
- High-temperature structural materials e.g., nickel aluminide, Ni3Al
- Dental amalgams, which are alloys of intermetallics Ag3Sn and Cu3Sn
- Gate contact/ barrier layer for microelectronics e.g., TiSi2[11]Template:Rp
- Laves phases (AB2), e.g., MgCu2, MgZn2 and MgNi2.
The unintended formation of intermetallics can cause problems. For example, intermetallics of gold and aluminium can be a significant cause of wire bond failures in semiconductor devices and other microelectronics devices. The management of intermetallics is a major issue in the reliability of solder joints between electronic components.Script error: No such module "Unsubst".
Intermetallic particles
Script error: No such module "Labelled list hatnote". Intermetallic particles often form during solidification of metallic alloys, and can be used as a dispersion strengthening mechanism.[1]
History
Examples of intermetallics through history include:
- Roman yellow brass, CuZn
- Chinese high tin bronze, Cu31Sn8
- Type metal, SbSn
- Chinese white copper, CuNi [12]
German type metal is described as breaking like glass, without bending, softer than copper, but more fusible than lead.[13]Template:Rp The chemical formula does not agree with the one above; however, the properties match with an intermetallic compound or an alloy of one.Script error: No such module "Unsubst".
See also
- Complex metallic alloys
- Kirkendall effect
- Maraging steel
- Metallurgy
- Solid solution
- Strukturbericht designation
- Order and disorder
References
- ↑ a b c d Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ G. E. R. Schulze: Metallphysik, Akademie-Verlag, Berlin 1967
- ↑ Script error: No such module "Citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "Citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
- ↑ Script error: No such module "citation/CS1".
Sources
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External links
- Intermetallics, scientific journal
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