View source for USB 3.0

{{short description|Third major version of the Universal Serial Bus standard}}
{{Redirect|SuperSpeed|3=Super Speed (disambiguation){{!}}Super Speed}}
{{Use dmy dates|date=August 2016}}
{{Infobox connector
| name               = USB&nbsp;3.0
| type               = [[USB]]
| image              = 
| logo               = [[File:Certified SuperSpeed USB Logo.svg|250px|Deprecated SuperSpeed USB logo]]
| caption            = Deprecated Certified SuperSpeed USB logo
|  designer           = 
| design_date        = {{start date and age|2008|11}}
| manufacturer       = USB 3.0 Promoter Group ([[Hewlett-Packard]], [[Intel]], [[Microsoft]], [[NEC]], [[ST-Ericsson]], and [[Texas Instruments]])<ref>{{cite web |title=Intel Universal Serial Bus (USB) Frequently Asked Questions (FAQ) |url= http://www.intel.com/content/www/us/en/io/universal-serial-bus/universal-serial-bus-faq.html |access-date=26 December 2014 |work=Intel.com |publisher=[[Intel Corporation]]}}</ref>
| production_date    = 
| superseded         = [[USB 2.0 Hi-Speed]]
| superseded_by      = [[#3.1|USB 3.1]], [[#3.2|USB 3.2]], [[USB4]]
| superseded_by_date = July 2013, September 2017, August 2019
| weight             = 
| length             = Standard‑A plug: 12&nbsp;mm<br>Standard‑B plug: 12&nbsp;mm<br>Type‑C (USB‑C) plug: 6.65&nbsp;mm
| diameter           = 
| width              = Standard‑A plug: 12&nbsp;mm<br>Standard‑B plug: 8&nbsp;mm<br>Micro‑A & Micro‑B plugs: 12.2&nbsp;mm<br>Type‑C (USB‑C) plug: 8.25&nbsp;mm
| height             = Standard‑A plug: 4.5&nbsp;mm<br>Standard‑B plug: 10.44&nbsp;mm<br>Micro‑A & Micro‑B plugs: 1.8&nbsp;mm<br>Type‑C (USB‑C) plug: 2.40&nbsp;mm
| hotplug            = 
| daisy_chain        = No
| external           = 
| electrical         = 
| earth              = 
| maximum_voltage    = 5V
| maximum_current    = 900&nbsp;mA<br>1.5&nbsp;A (BC&nbsp;1.1/1.2, USB&nbsp;3.2 single-lane)<br>3&nbsp;A (USB&nbsp;3.2 multi-lane Type‑C)
| audio_signal       = No
| video_signal       = No
| data_signal        = Yes
| data_bit_width     = 
| data_bandwidth     = 5&nbsp;Gbit/s (500&nbsp;MB/s, USB 3.0)<br>10&nbsp;Gbit/s (1.212&nbsp;GB/s, USB&nbsp;3.1 Gen&nbsp;2)<br>20&nbsp;Gbit/s (2.422&nbsp;GB/s, USB&nbsp;3.2 Gen&nbsp;2×2)
| data_devices       = 
| data_style         = 
| cable              = 
| physical_connector = {{nowrap|USB-C (USB&nbsp;Type‑C)}},<br>{{nowrap|USB 3.0 Standard‑A}},<br>{{nowrap|USB 3.0 Standard‑B}},<br>{{nowrap|Powered‑B}},<br>{{nowrap|USB 3.0 Micro‑A}},<br>{{nowrap|USB 3.0 Micro‑B}},<br>{{nowrap|USB 3.0 Micro‑AB receptacle}}
| num_pins           = Type‑C, 24 (plug 22); Micro, 10; Standard, 9)
| pinout_col1_name   = 
| pinout_col2_name   = 
| pinout_image       = 
| pinout_caption     = 
}}
[[File:Certified SuperSpeed USB 5 Gbps Logo.svg|thumb|A deprecated<ref name="USB-IF Licensed Mark(s) Requirements"/> SuperSpeed USB 5&nbsp;Gbit/s packaging logo]]
'''Universal Serial Bus 3.0''' ('''USB 3.0'''), marketed as '''SuperSpeed USB''', is the third major version of the [[Universal Serial Bus]] (USB) standard for interfacing computers and electronic devices. It was released in November 2008. The USB 3.0 specification defined a new architecture and protocol, named SuperSpeed, which included a new lane for providing full-duplex data transfers that physically required five additional wires and pins, while also adding a new signal coding scheme (8b/10b symbols, 5&nbsp;Gbit/s; also known later as ''Gen&nbsp;1''), and preserving the USB 2.0 architecture and protocols and therefore keeping the original four pins and wires for the USB 2.0 backward-compatibility, resulting in nine wires in total and nine or ten pins at connector interfaces (ID-pin is not wired). The new transfer rate, marketed as ''SuperSpeed USB'' (SS), can transfer signals at up to 5&nbsp;[[Gbit/s]] (with raw data rate of 500&nbsp;[[MB/s]] after encoding overhead), which is about 10 times faster than High-Speed (maximum for [[USB&nbsp;2.0]] standard). In USB&nbsp;3.0 Type‑A (and usually also Type-B) connectors the visible inside insulators are often blue, to distinguish them from USB&nbsp;2.0 connectors, as recommended by the specification,<ref name="USB 3.1 spec" />{{rp|at=§5.3.1.4}} and by the initials ''SS''.<ref>{{cite book |last=McFedries |first=Paul |chapter=Connecting USB Devices |title=PCs for Grown-Ups: Getting the Most Out of Your Windows 8 Computer |url= https://archive.org/details/pcsforgrownupsge0000mcfe |url-access=registration |via=Internet Archive |location=Indianapolis |publisher=Que Publishing |date=2013 |isbn=978-0-13-303501-8 |access-date=18 February 2016 |quote=Most PC manufacturers label each USB port using the logo for USB type ... the USB 2.0 logo is a trident, while the USB 3.0 logo is a similar trident with the letters 'SS' (which stands for SuperSpeed) attached.}}</ref>

[[#3.1|USB&nbsp;3.1]], released in July 2013, is the successor specification that fully replaces the USB&nbsp;3.0 specification. USB&nbsp;3.1 preserves the existing ''SuperSpeed USB'' architecture and protocol with its operation mode (8b/10b symbols, 5&nbsp;Gbit/s), giving it the label ''USB 3.1 Gen 1''.<ref name="3.1 SLUG">{{Cite web |url= http://www.usb.org/developers/ssusb/USB_3_1_Language_Product_and_Packaging_Guidelines_FINAL.pdf |title=USB 3.1 Specification Language Usage Guidelines from USB-IF |date=28 May 2015 |work=USB.org |publisher=USB Implementers Forum |access-date=10 March 2016 |archive-url= https://web.archive.org/web/20160312135950/http://www.usb.org/developers/ssusb/USB_3_1_Language_Product_and_Packaging_Guidelines_FINAL.pdf |archive-date=12 March 2016 |url-status=dead}}</ref><ref>{{cite web |url= https://www.msi.com/blog/usb-3-1-gen1-gen2-explained |title=USB 3.1 Gen 1 & Gen 2 explained |date=5 August 2015 |work=MSI.com |publisher=[[Micro-Star International]]}}</ref> USB 3.1 introduced an ''Enhanced SuperSpeed System'' – while preserving and incorporating the SuperSpeed architecture and protocol (aka ''SuperSpeed USB'') – with an additional ''SuperSpeedPlus'' architecture adding and providing a new coding schema (128b/132b symbols) and protocol named ''SuperSpeedPlus'' (aka ''SuperSpeedPlus USB'', sometimes marketed as ''SuperSpeed+'' or ''SS+'') while defining a new transfer mode called ''USB 3.1 Gen 2''<ref name="3.1 SLUG" /> with a signal speed of 10&nbsp;Gbit/s and a raw data rate of 1212&nbsp;MB/s over existing Type‑A, Type‑B, and [[USB-C|Type‑C]] (USB‑C) connections, more than twice the rate of USB&nbsp;3.0 (aka Gen 1).<ref name=":0">{{cite web |url= http://www.usb.org/developers/docs/ |title=Universal Serial Bus 3.2 Specification |access-date=30 August 2018 |publisher=USB Implementers Forum |work=USB.org}}</ref><ref name="USB 3.1 spec">{{cite web |url= http://www.usb.org/developers/docs/usb_31_102214.zip |archive-url= https://web.archive.org/web/20141121225502/http://www.usb.org/developers/docs/usb_31_102214.zip |title=Universal Serial Bus Revision 3.1 Specification  |access-date=19 November 2014 |archive-date=21 November 2014 |work=USB.org |publisher=USB Implementers Forum |format=ZIP |url-status=dead
}}</ref> Backward-compatibility is still given by the parallel USB 2.0 implementation. USB 3.1 Gen 2 Standard‑A and Standard‑B connectors are often teal-colored, though this is nonstandard. (The standard recommends that all Standard‑A plugs and receptacles capable of USB&nbsp;3, including those capable of Gen&nbsp;2, have blue insulators, specifically Pantone 300 C. It makes no mention of teal, or Standard‑B connector color, and all other Type‑A and Type‑B connectors—Micro and Mini—are required to have white, black, or grey insulators for Type‑A, ‑B, and ‑AB, respectively.)

[[#3.2|USB&nbsp;3.2]], released in September 2017, fully replaces the USB&nbsp;3.1 specification. The USB&nbsp;3.2 specification added a second lane to the Enhanced SuperSpeed System besides other enhancements, so that SuperSpeedPlus USB implements the ''Gen&nbsp;2×1'' (formerly known as ''USB&nbsp;3.1 Gen&nbsp;2''), and the two new ''Gen 1×2'' and ''Gen 2×2'' operation modes while operating on two lanes. The SuperSpeed architecture and protocol (aka SuperSpeed USB) still implements the one-lane ''Gen&nbsp;1×1'' (formerly known as ''USB&nbsp;3.1 Gen&nbsp;1'') operation mode. Therefore, two-lane operations, namely ''USB&nbsp;3.2 Gen&nbsp;1×2'' (10&nbsp;Gbit/s with raw data rate of 1&nbsp;GB/s after encoding overhead) and ''USB&nbsp;3.2 Gen&nbsp;2×2'' (20&nbsp;Gbit/s, 2.422&nbsp;GB/s), are only possible with Full-Featured Fabrics (host, hubs, peripheral device, and fully wired cables and plugs with 24 pins). As of 2023, USB&nbsp;3.2 Gen&nbsp;1×2 and Gen&nbsp;2×2 are not implemented on many products yet; Intel, however, started to include them in its [[LGA 1200|LGA 1200 Rocket Lake chipsets (500 series)]] in January 2021 and AMD in its [[Socket AM5|LGA 1718 AM5 chipsets]] in September 2022, but Apple never provided them. On the other hand, USB&nbsp;3.2 Gen&nbsp;1×1 (5&nbsp;Gbit/s) and Gen&nbsp;2×1 (10&nbsp;Gbit/s) implementations have become quite common. Again, backward-compatibility is given by the parallel USB&nbsp;2.0 implementation.

==Overview==
The USB&nbsp;3.0 specification is similar to [[USB&nbsp;2.0]], but with many improvements and an alternative implementation. Earlier USB concepts such as endpoints and the four transfer types (bulk, control, [[isochronous]] and interrupt) are preserved but the protocol and electrical interface are different. The specification defines a physically separate channel to carry USB&nbsp;3.0 traffic. The changes in this specification make improvements in the following areas:
* Transfer speed{{snd}} USB&nbsp;3.0 adds a new transfer type called SuperSpeed or SS, 5&nbsp;Gbit/s (electrically, it is more similar to [[PCI Express 2.0]] and [[Serial ATA|SATA]] than USB&nbsp;2.0).<ref>{{cite journal|title=USB 3.0 Physical Layer Measurements |journal=Evaluation Engineering |last=Engbretson |first=Mike |date=January 2009 |url= https://www.evaluationengineering.com/home/article/13003984/usb-30-physical-layer-measurements |access-date=31 January 2013}}</ref>
* Increased bandwidth{{snd}} USB&nbsp;3.0 uses two unidirectional data paths instead of only one: one to receive data and the other to transmit.
* Power management{{snd}} U0 to U3 link power management states are defined.
* Improved bus use{{snd}} a new feature is added (using packets NRDY and ERDY) to let a device asynchronously notify the host of its readiness, with no need for polling.
* Support for rotating media{{snd}} the bulk protocol is updated with a new feature called Stream Protocol that allows a large number of logical streams within an Endpoint.

USB&nbsp;3.0 has transmission speeds of up to 5&nbsp;Gbit/s, or 5000&nbsp;Mbit/s, about ten times as fast as USB&nbsp;2.0 (0.48&nbsp;Gbit/s) even without considering that USB&nbsp;3.0 is [[full duplex]] whereas USB&nbsp;2.0 is [[half duplex]]. This gives USB&nbsp;3.0 a potential total bidirectional bandwidth twenty times as great as that of USB 2.0.<ref>{{cite web |url= http://h20195.www2.hp.com/v2/GetPDF.aspx%2F4AA4-2724ENW.pdf |title=USB 3.0 Technology |year=2012 |access-date=2 January 2014 |publisher=hp.com |archive-url= https://web.archive.org/web/20140103080959/http://h20195.www2.hp.com/v2/GetPDF.aspx%2F4AA4-2724ENW.pdf |archive-date=3 January 2014 |url-status=dead}}</ref> Considering flow control, packet framing and protocol overhead, applications can expect 450&nbsp;MB/s of bandwidth.<ref name="USB 3.2 spec 1.0"/>

===Architecture and features===
[[File:Connector USB 3 IMGP6024 wp.jpg|thumb|upright|Front view of a Standard‑A USB&nbsp;3.0 plug, showing its front row of four pins for power and USB&nbsp;1.x/2.0, and a second row of five pins for the later USB&nbsp;3.0 connectivity. The insulator is in the USB 3.0 standard blue color, Pantone 300&nbsp;C.]]

In USB&nbsp;3.0, dual-bus architecture is used to allow both USB&nbsp;2.0 (Full Speed, Low Speed, or High Speed) and USB&nbsp;3.0 (SuperSpeed) operations to take place simultaneously, thus providing [[backward compatibility]]. The structural topology is the same, consisting of a tiered star topology with a root hub at level 0 and hubs at lower levels to provide bus connectivity to devices.

===Data transfer and synchronization===
The SuperSpeed transaction is initiated by a host request, followed by a response from the device. The device either accepts the request or rejects it; if accepted, the device sends data or accepts data from the host. If the endpoint is halted, the device responds with a STALL handshake. If there is lack of buffer space or data, it responds with a Not Ready (NRDY) signal to tell the host that it is not able to process the request. When the device is ready, it sends an Endpoint Ready (ERDY) to the host which then reschedules the transaction.

The use of [[unicast]] and the limited number of [[multicast]] packets, combined with asynchronous notifications, enables links that are not actively passing packets to be put into reduced power states, which allows better power management.

USB&nbsp;3.0 uses a [[Spread Spectrum Clock|spread-spectrum clock]] varying by up to 5000&nbsp;ppm at 33&nbsp;kHz to reduce EMI. As a result, the receiver needs to continually "chase" the clock to recover the data. [[Clock recovery]] is helped by the 8b/10b encoding and other designs.<ref>{{cite web |title=The USB 3.0 physical layer |url=https://www.techdesignforums.com/practice/technique/usb-3-0-physical-layer/ |website=www.techdesignforums.com}}</ref>

===Data encoding===
The ''"SuperSpeed"'' bus provides for a transfer mode at a nominal rate of 5.0&nbsp;Gbit/s, in addition to the three existing transfer modes. Accounting for the encoding overhead, the raw data throughput is 4&nbsp;Gbit/s, and the specification considers it reasonable to achieve 3.2&nbsp;Gbit/s (400&nbsp;MB/s) or more in practice.<ref name="USB 3.0 spec">{{cite web |title=Universal Serial Bus Revision 3.0 Specification |url= http://www.usb.org/developers/docs/documents_archive/usb_30_spec_070113.zip |access-date=19 May 2014 |archive-url= https://web.archive.org/web/20140519092924/http://www.usb.org/developers/docs/documents_archive/usb_30_spec_070113.zip |archive-date=19 May 2014 |url-status=dead|date=2011-06-06|version=1.0}}</ref>

All data is sent as a stream of eight-bit (one-byte) segments that are scrambled and converted into 10-bit symbols via [[8b/10b encoding]]; this helps prevent transmissions from generating [[electromagnetic interference]] (EMI).<ref name=":0" /> Scrambling is implemented using a free-running [[LFSR|linear feedback shift register]] (LFSR). The LFSR is reset whenever a COM symbol is sent or received.<ref name="USB 3.0 spec" />

Unlike previous standards, the USB&nbsp;3.0 standard does not specify a maximum cable length, requiring only that all cables meet an electrical specification: for copper cabling with [[American wire gauge|AWG]] 26 wires, the maximum practical length is {{convert|3|m|ft|0|sp=us}}.<ref>{{cite web |url= http://janaxelson.com/usb3faq.htm#ca_maximum |title=USB 3.0 Developers FAQ  |access-date=14 November 2018 |first=Jan |last=Axelson |work=JanAxelson.com
}}</ref>

===Power and charging===
As with earlier versions of USB, USB 3.0 provides power at 5&nbsp;volts nominal. The available current for low-power (one unit load) SuperSpeed devices is 150&nbsp;mA, an increase from the 100&nbsp;mA defined in USB 2.0. For high-power SuperSpeed devices, the limit is six unit loads or 900&nbsp;mA (4.5&nbsp;[[watt (unit)|W]])—almost twice USB 2.0's 500&nbsp;mA.<ref name="USB 3.0 spec" />{{rp|section 9.2.5.1 Power Budgeting}}

USB 3.0 ports may implement other USB specifications for increased power, including the [[USB Battery Charging Specification]] for up to 1.5&nbsp;A or 7.5&nbsp;W, or, in the case of USB 3.1, the [[USB Power Delivery Specification]] for charging the host device up to 100&nbsp;W.<ref name="power_spec">
{{cite web |title=USB Power Delivery Specification 1.0 |url= http://www.usb.org/developers/powerdelivery/PD_1.0_Introduction.pdf |access-date=14 November 2015 |archive-url= https://web.archive.org/web/20160404052839/http://www.usb.org/developers/powerdelivery/PD_1.0_Introduction.pdf |archive-date=4 April 2016 |url-status=dead}}
</ref>

===Naming scheme===
Starting with the USB 3.2 specification, USB-IF introduced a new naming scheme.<ref name="3.2 SLUG">{{Cite web|url=https://www.usb.org/sites/default/files/usb_3_2_language_product_and_packaging_guidelines_final.pdf |title=USB 3.2 Specification Language Usage Guidelines from USB-IF|date=26 February 2019 |website=usb.org |access-date=4 September 2019 |archive-date=3 November 2021|archive-url=https://web.archive.org/web/20211103022718/https://www.usb.org/sites/default/files/usb_3_2_language_product_and_packaging_guidelines_final.pdf|url-status=live}}</ref> To help companies with branding of the different operation modes, USB-IF recommended branding the 5, 10, and 20&nbsp;Gbit/s capabilities as ''SuperSpeed USB 5Gbps'', ''SuperSpeed USB 10&nbsp;Gbps'', and ''SuperSpeed USB 20&nbsp;Gbps'', respectively.<ref>{{Cite web|last=Ravencraft|first=Jeff|url=https://www.usb.org/sites/default/files/D1T2-1%20-%20USB%20Branding%20Session.pdf|title=USB DevDays 2019 – Branding Session|date=19 November 2019|website=USB Implementers Forum|pages=16|type=Presentation|access-date=22 March 2020|archive-url=https://web.archive.org/web/20200322121822/https://www.usb.org/sites/default/files/D1T2-1%20-%20USB%20Branding%20Session.pdf|archive-date=22 March 2020}}</ref>

In 2023, they were replaced again,<ref name="usb.org">[https://www.usb.org/sites/default/files/usb_data_performance_language_usage_guidelines_jan_2024.pdf USB Data Performance Language Usage Guidelines from USB-IF]</ref> replacing ''"SuperSpeed"'' with ''USB 5Gbps'', ''USB 10Gbps'', and ''USB 20Gbps'', and introducing new ''Packaging'' and ''Port'' logos.<ref name="new_and_deprecated_logos-2023">[https://www.usb.org/sites/default/files/trademark_license_agreement_licensed_mark_requirements_final_as_of_september_20_2023.pdf Trademark Requirements Chart]</ref>

==Availability==
[[File:VIA Labs VL811 USB 3.0 4-Port Hub - Board Angle (6119774674).jpg|thumbnail|Internal circuit board and connectors of a USB&nbsp;3.0 four-port hub, using a [[VIA Technologies]] chipset]]

The USB 3.0 Promoter Group announced on 17 November 2008 that the specification of version 3.0 had been completed and had made the transition to the [[USB Implementers Forum]] (USB-IF), the managing body of USB specifications.<ref name="ReferenceA">{{cite web |url= http://www.usb.org/press/USB-IF_Press_Releases/2008_11_17_USB_IF.pdf |title=USB-IF |work=USB.org |publisher=USB Implementers Forum |date=17 November 2008 |access-date=22 June 2010 |url-status=dead |archive-url= https://web.archive.org/web/20100331035202/http://www.usb.org/press/USB-IF_Press_Releases/2008_11_17_USB_IF.pdf |archive-date=31 March 2010}}</ref> This move effectively opened the specification to hardware developers for implementation in future products.

The first USB 3.0 consumer products were announced and shipped by [[Buffalo Technology]] in November 2009, while the first certified USB&nbsp;3.0 consumer products were announced on 5 January 2010, at the Las Vegas [[Consumer Electronics Show]] (CES), including two motherboards by [[Asus]] and [[Gigabyte Technology]].<ref name="usb3_first_17">{{cite web |url=https://www.pcworld.com/article/186209/usb_3_0.html |title=First Certified USB 3.0 Products Announced |work=[[PC World]] |date=7 January 2010 |access-date=22 June 2010|archive-url=https://web.archive.org/web/20121019125507/http://www.pcworld.com/article/186209/usb_3_0.html|archive-date=2012-10-19}}</ref><ref name="usb3_first_17pdf">{{cite web |url= http://www.usb.org/press/SuperSpeed_USB_Consumer_Cert_FINAL_2_.pdf |title=SuperSpeed USB Consumer Cert Final 2 |work=USB.org |publisher=USB Implementers Forum |access-date=24 June 2011 |archive-url= https://web.archive.org/web/20120402051100/http://www.usb.org/press/SuperSpeed_USB_Consumer_Cert_FINAL_2_.pdf |archive-date=2 April 2012 |url-status=dead}}</ref>

Manufacturers of USB 3.0 host controllers include, but are not limited to, [[Renesas Electronics]], Fresco Logic, [[ASMedia]], Etron, [[VIA Technologies]], [[Texas Instruments]], [[NEC]] and [[Nvidia]]. As of November 2010, Renesas and Fresco Logic<ref>{{cite press release |title=USB-IF announces second certified USB 3.0 host controller |publisher=USB Implementers Forum, Inc. |date=16 November 2010 |url= https://www.businesswire.com/news/home/20101116005617/en/USB-IF-Announces-Certified-USB-3.0-Host-Controller |access-date=30 August 2018}}</ref> have passed USB-IF certification. Motherboards for [[Intel]]'s [[Sandy Bridge]] processors have been seen with Asmedia and Etron host controllers as well. On 28 October 2010, [[Hewlett-Packard]] released the [[HP Envy]] 17 3D featuring a Renesas USB&nbsp;3.0 host controller several months before some of their competitors. [[AMD]] worked with Renesas to add its USB&nbsp;3.0 implementation into its chipsets for its 2011 platforms.{{Update after|2011|12|31}} At CES2011, [[Toshiba]] unveiled a laptop called "[[Qosmio]] X500" that included USB 3.0 and [[Bluetooth 3.0]], and [[Sony]] released a new series of [[Sony VAIO]] laptops that would include USB&nbsp;3.0. As of April 2011, the [[Inspiron]] and [[Dell XPS]] series were available with USB&nbsp;3.0 ports, and, as of May 2012, the [[Dell Latitude]] laptop series were as well; yet the USB root hosts failed to work at SuperSpeed under Windows 8.

===Adding to existing equipment===
[[File:Rosewill-USB3-PCI-Express-Card.jpg|thumb|A USB&nbsp;3.0 controller in the form of a PCI Express [[expansion card]]]]
[[File:Lenovo x220.jpg|thumb|Side connectors on a laptop computer. Left to right: USB&nbsp;3.0 Standard‑A (host) port (the five additional contacts for USB 3 visible on the underside of the tongue), [[VGA connector]], [[DisplayPort]] connector, USB&nbsp;2.0 Standard‑A (host) port.]]

Additional power for multiple ports on a laptop PC may be obtained in the following ways:
* Some [[ExpressCard]]-to-USB&nbsp;3.0 adapters may connect by a cable to an additional USB&nbsp;2.0 port on the computer, which supplies additional power.
* The ExpressCard may have a socket for an external power supply.
* If the external device has an appropriate connector, it can be powered by an [[external power supply]].
* USB&nbsp;3.0 port provided by an ExpressCard-to-USB&nbsp;3.0 adapter may be connected to a separately-powered USB&nbsp;3.0 hub, with external devices connected to that USB&nbsp;3.0 hub.

On the motherboards of desktop PCs which have [[PCI Express]] (PCIe) slots (or the older [[Peripheral Component Interconnect|PCI]] standard), USB&nbsp;3.0 support can be added as a PCI Express [[expansion card]]. In addition to an empty PCIe slot on the motherboard, many "PCI Express to USB&nbsp;3.0" expansion cards must be connected to a power supply such as a [[Molex connector|Molex]] adapter or external power supply, in order to power many USB&nbsp;3.0 devices such as mobile phones, or external hard drives that have no power source other than USB; as of 2011, this is often used to supply two to four USB&nbsp;3.0 ports with the full 0.9&nbsp;A (4.5&nbsp;W) of power that each USB&nbsp;3.0 port is capable of (while also transmitting data), whereas the PCI Express slot itself cannot supply the required amount of power.

If faster connections to storage devices are the reason to consider USB&nbsp;3.0, an alternative is to use [[eSATAp]], possibly by adding an inexpensive expansion slot bracket that provides an eSATAp port; some external hard disk drives provide both USB (2.0 or 3.0) and eSATAp interfaces.<ref name="usb3_first_17pdf" /> To ensure compatibility between motherboards and peripherals, all USB-certified devices must be approved by the [[USB Implementers Forum]] (USB-IF). At least one complete end-to-end test system for USB&nbsp;3.0 designers is available on the market.<ref name="USB 3.0 Test Suite">{{cite web |url= http://www.lecroy.com/tm/solutions/serialdata/usb3/ |title=USB 3 |publisher=Lecroy |access-date=22 June 2010}}</ref>

===Adoption===
The USB Promoter Group announced the release of USB 3.0 in November 2008. On 5 January 2010, the [[USB-IF]] announced the first two certified USB 3.0 motherboards, one by [[Asus|ASUS]] and one by [[Gigabyte Technology|Giga-Byte Technology]].<ref name="usb3_first_17pdf"/><ref>{{cite press release |url= http://www.usb.org/press/SuperSpeed_USB_Consumer_Cert_FINAL_2_.pdf |publisher=USB Implementers Forum |title=First Certified Superspeed USB Consumer Products Announced |date=5 January 2010 |url-status=dead |archive-url= https://web.archive.org/web/20100114073455/http://www.usb.org/press/SuperSpeed_USB_Consumer_Cert_FINAL_2_.pdf |archive-date=14 January 2010}}</ref> Previous announcements included Gigabyte's October 2009 list of seven [[List of Intel chipsets|P55 chipset]] USB 3.0 motherboards,<ref>{{cite web |url= https://www.gigabyte.com/microsite/102/data/mb-usb3-models.htm |title=USB 3.0 Motherboards |work=Gigabyte.com |publisher=[[Gigabyte Technology]] |location=Indianapolis |url-status= live |archive-url= https://web.archive.org/web/20100601032213/https://www.gigabyte.com/microsite/102/data/mb-usb3-models.htm |archive-date=1 June 2010 <!--This is the closest archival date to the 2009 version mentioned.--> |access-date=14 October 2019}}.</ref> and an Asus motherboard that was cancelled before production.<ref>{{cite web |url= https://www.theinquirer.net/inquirer/news/1495417/asus-cancels-usb-motherboard |last=Kerr |first=Rob |date=28 July 2009 |archive-url= https://web.archive.org/web/20090730190448/http://www.theinquirer.net/inquirer/news/1495417/asus-cancels-usb-motherboard |url-status=dead |archive-date= 30 July 2009 |title=Asus cancels its first usb 3.0 motherboard |work=[[The Inquirer]] |access-date=22 June 2010}}</ref>

Commercial controllers were expected to enter into volume production in the first quarter of 2010.<ref name="Farady and Fresco Logic to introduce USB 3.0 controllers">{{cite web |url= http://www.digitimes.com/news/a20090415PB204.html |title=Digitimes |date=15 March 2009 |access-date=22 June 2010}}</ref> On 14 September 2009, [[Freecom]] announced a USB 3.0 external hard drive.<ref name="World's first USB 3.0 ready external hard drive">{{cite web |url= http://www.freecom.com/news.asp?id=9205&catName=press |title=Freecom.com |access-date=22 June 2010 |url-status=dead |archive-url= https://web.archive.org/web/20100617080920/http://www.freecom.com/news.asp?id=9205&catName=press |archive-date=17 June 2010}}</ref> On 4 January 2010, [[Seagate Technology|Seagate]] announced a small portable HDD bundled with an additional USB&nbsp;3.0 [[ExpressCard]], targeted for laptops (or desktops with ExpressCard slot addition) at the CES in Las Vegas Nevada.<ref>{{cite web |last=Ngo |first=Dong |url=http://ces.cnet.com/8301-31045_1-10420360-269.html |title=Seagate ships USB 3.0-based external hard-drive kit for laptops &#124; CES |publisher=CNET |date=5 January 2010 |access-date=22 June 2010 |archive-date=15 July 2011 |archive-url=https://web.archive.org/web/20110715101446/http://ces.cnet.com/8301-31045_1-10420360-269.html |url-status=dead }}</ref><ref>{{cite web |url= http://www.seagate.com/www/en-us/products/external/blackarmor/blackarmor_ps_110_usb3/?intcmp=bac-en-us-home-h_hero1-baps110kit |archive-url= https://web.archive.org/web/20100815044140/http://www.seagate.com/www/en-us/products/external/blackarmor/blackarmor_ps_110_usb3/?intcmp=bac-en-us-home-h_hero1-baps110kit |title=BlackArmor PS 110 with USB 3.0 &#124; Portable Hard Drive for Business with Backup Software |publisher=Seagate |access-date=18 January 2014 |archive-date=15 August 2010}}</ref>

The [[Linux kernel mainline]] contains support for USB&nbsp;3.0 since version 2.6.31, which was released in September 2009.<ref name="Linux 2.6.31 kernel news">{{cite web |url= http://kernelnewbies.org/Linux_2_6_31 |title=Kernel newbies |date=9 September 2009 |access-date=22 June 2010}}</ref><ref name="German: First USB 3 drivers coming with Linux Kernel 2.6.31">{{cite web |trans-title=First USB 3 drivers coming with Linux 2.6.31 |url= http://www.heise.de/newsticker/Erste-USB-3-0-Treiber--/meldung/140103 |title=Erste USB 3.0 Treiber |work=Heise Online |publisher=Heise Medien |location=Germany |language=de |date=3 December 2009 |access-date=22 June 2010}}</ref><ref name="First Driver for USB 3.0">{{cite web |url= http://www.linux-magazine.com/online/news/first_driver_for_usb_3_0 |title=First driver for USB 3.0 |publisher=Linux magazine |date=9 June 2009 |access-date=22 June 2010}}</ref>

[[FreeBSD]] supports USB&nbsp;3.0 since version 8.2, which was released in February 2011.<ref>{{cite web |url= https://www.freebsd.org/releases/8.2R/relnotes.html |title=FreeBSD 8.2-RELEASE Release Notes |date=13 November 2013 |access-date=5 August 2015 |work=FreeBSD.org}}</ref>

[[Windows 8]] was the first Microsoft operating system to offer built in support for USB 3.0.<ref>{{cite web |first=Bob |last=McVay |url= http://channel9.msdn.com/Events/BUILD/BUILD2011/HW-256T |title=Understanding USB 3.0 in Windows 8 &#124; Build2011 &#124; Channel 9 |work=Channel9.MSDN.com |date=15 September 2011 |access-date=19 January 2014}}</ref> In [[Windows 7]] support was not included with the initial release of the operating system.<ref name="USB 3 in Windows 7">{{cite web |url= http://apcmag.com/usb_in_windows_7_more_reliable_but_no_30_speed_boost.htm |title=USB in MS Windows 7 more reliable, but no 3.0 speed boost |work=APCMag.com |access-date=22 June 2010}}</ref> However, drivers that enable support for Windows 7 are available through websites of hardware manufacturers.

[[Intel Corporation|Intel]] released its first [[chipset]] with integrated USB 3.0 ports in 2012 with the release of the [[Panther Point#Panther Point|Panther Point]] chipset. Some industry analysts have claimed that Intel was slow to integrate USB 3.0 into the chipset, thus slowing mainstream adoption.<ref>{{cite web |last=Crothers |first=Brooke |url= http://news.cnet.com/8301-13924_3-20001891-64.html |title=Long delay expected for Intel support of USB 3.0 &#124; Nanotech&nbsp;– The Circuits Blog |work=[[CNet News]] |date=7 March 2010 |access-date=19 January 2014}}</ref> These delays may be due to problems in the [[CMOS]] manufacturing process,<ref name="heise.de">{{cite web |url= http://www.heise.de/newsticker/meldung/Spekulationen-ueber-Verzoegerungen-bei-USB-3-0-835980.html |work=Heise Online |publisher=Heise Medien |location=Germany |language=de |title=Spekulationen über Verzögerungen bei USB 3.0|date=21 October 2009 }}</ref> a focus to advance the [[Nehalem (microarchitecture)|Nehalem]] platform,<ref>{{cite web |first=Paul |last=Mah |url= http://www.fiercecio.com/techwatch/story/insider-intel-hindering-usb-3-0-adoption/2009-10-23 |title=Fiercecio.com |date=23 October 2009 |access-date=22 June 2010}}</ref> a wait to mature all the 3.0 connections standards (USB 3.0, [[PCI Express 3|PCIe 3.0]], [[Sata 600|SATA 3.0]]) before developing a new chipset,<ref>{{cite web |url=http://www.pcisig.com/news_room/faqs/pcie3.0_faq/ |title=FAQ&nbsp;— PCI Express 3.0 |website=PCISIG.com |publisher=Peripheral Component Interconnect Special Interest Group |date=1 July 2009 |access-date=22 June 2010 |archive-date=1 February 2014 |archive-url=https://web.archive.org/web/20140201172536/http://www.pcisig.com/news_room/faqs/pcie3.0_faq/ |url-status=dead }}</ref><ref>{{cite web |url= http://www.enterprisestorageforum.com/technology/news/article.php/3880536 |title=PCIe 3.0 Specification Coming Soon |work=Enterprise Storage Forum |date=5 May 2010 |access-date=22 June 2010 |archive-url= https://web.archive.org/web/20110710194442/http://www.enterprisestorageforum.com/technology/news/article.php/3880536 |archive-date=10 July 2011 |url-status=dead}}</ref> or a tactic by Intel to favor its new [[Thunderbolt (interface)|Thunderbolt]] interface.<ref>{{cite web |url= http://www.techspot.com/news/36673-intel-delays-usb-30-support-until-2011.html |title=Intel delays USB 3.0 support until 2011 |work=TechSpot |date=22 October 2009 |access-date=22 June 2010}}</ref> Apple, Inc. announced laptops with USB 3.0 ports on 11 June 2012, nearly four years after USB 3.0 was finalized.

[[Advanced Micro Devices|AMD]] began supporting USB 3.0 with its [[A85X|Fusion Controller Hubs]] in 2011. [[Samsung Electronics]] announced support of USB 3.0 with its [[ARM architecture|ARM]]-based [[Exynos|Exynos 5 Dual]] platform intended for handheld devices.

==Issues==

===Speed and compatibility===
Various early USB&nbsp;3.0 implementations widely used the [[NEC]]/[[Renesas Electronics|Renesas]] μD72020x family of host controllers,<ref>{{cite web |author=TeamVR |url=http://vr-zone.com/articles/usb-3-0-speed-tests-7-way-host-controllers-roundup/13358.html/5 |title=USB 3.0 Speed Tests: 7-way Host Controllers Roundup&nbsp;– Page 5 of 11 |work=VR-Zone.com |date=23 August 2011 |access-date=19 January 2014 |archive-date=1 February 2014 |archive-url=https://web.archive.org/web/20140201191302/http://vr-zone.com/articles/usb-3-0-speed-tests-7-way-host-controllers-roundup/13358.html/5 |url-status=dead }}</ref> which are known to require a firmware update to function properly with some devices.<ref>{{cite web |url= https://downloadcenter.intel.com/Detail_Desc.aspx?DwnldID=22775 |title=USB 3.0: Renesas Electronics USB 3.0 Firmware Updates |work=DownloadCenter.Intel.com |publisher=Intel Corporation |access-date=19 January 2014 |quote=These firmware updates resolve the following issues related to the USB 3.0 ports on these boards: • BIOS and operating system do not detect devices attached to the USB 3.0 ports. • System hangs on POST code 58 for one minute if any device is attached to USB 3.0 ports, and then continues the boot process. • In Device Manager, the Renesas USB 3.0 eXtensible Host Controller is shown with a yellow bang and the error message 'Windows has stopped this device because it has reported problems. Code 43'.}}</ref><ref>{{cite web |url= http://askubuntu.com/questions/161862/nec-upd720200-usb-3-0-not-working-on-ubuntu-12-04 |title=NEC uPD720200 USB 3.0 not working on Ubuntu 12.04 |work=Ask Ubuntu |publisher=[[Stack Exchange Network]] |access-date=19 January 2014}}</ref><ref>{{cite web |url= http://www.gigabyte.com/support-downloads/faq-page.aspx?fid=1380 |title=How to improve the compatibility of USB3.0 devices? |work=Gigabyte.com |publisher=[[Gigabyte Technology]] |access-date=19 January 2014}}</ref>

A factor affecting the speed of USB storage devices (more evident with USB&nbsp;3.0 devices, but also noticeable with USB&nbsp;2.0 ones) is that the [[USB Mass Storage Bulk-Only Transfer]] (BOT) protocol drivers are generally slower than the [[USB Attached SCSI]] protocol (UAS[P]) drivers.<ref>{{cite web |first=Lars-Göran |last=Nilsson |url= http://semiaccurate.com/2010/07/30/gigabyte-adds-uasp-support-its-usb-30-motherboards/ |title=Gigabyte adds UASP support to its USB 3.0 motherboards |work=SemiAccurate |date=30 July 2010 |access-date=19 January 2014}}</ref><ref>{{cite web |first=Lars-Göran |last=Nilsson |url= http://semiaccurate.com/2010/08/11/gigabytes-uasp-usb-30-driver-boosts-usb-20-performance/ |title=Gigabyte's UASP USB 3.0 driver boosts USB 2.0 performance |work=SemiAccurate |date=11 August 2010 |access-date=19 January 2014}}</ref><ref>{{cite web |first=Andrew |last=Ku |url= http://www.tomshardware.com/reviews/usb-3-uas-turbo,3215-4.html |title=USB Attached SCSI (UAS): Enabling Even Better USB 3.0 Performance&nbsp;– Faster USB 3.0 Performance: Examining UASP And Turbo Mode |work=Tom's Hardware |date=19 June 2012 |access-date=19 January 2014}}</ref><ref>{{cite web |last=Hamid |first=Adnan |url= http://electronicdesign.com/embedded/whats-difference-between-usb-uasp-and-bot |title=What's the Difference Between USB UASP And BOT &#124; Embedded content from |work=Electronic Design |date=18 March 2012 |access-date=22 January 2014}}</ref>

On some old (2009&ndash;2010) [[Ibex Peak]]-based motherboards, the built-in USB&nbsp;3.0 chipsets are connected by default via a 2.5&nbsp;[[Transfer (computing)|GT/s]] [[PCI Express]] lane of the [[Platform Controller Hub|PCH]], which then did not provide full PCI Express 2.0 speed (5&nbsp;GT/s), so it did not provide enough bandwidth even for a single USB&nbsp;3.0 port. Early versions of such boards (e.g. the [[Gigabyte Technology]] P55A-UD4 or P55A-UD6) have a manual switch (in BIOS) that can connect the USB&nbsp;3.0 chip to the processor (instead of the PCH), which did provide full-speed PCI Express 2.0 connectivity even then, but this meant using fewer PCI Express 2.0 lanes for the graphics card. However, newer boards (e.g. Gigabyte P55A-UD7 or the Asus P7P55D-E Premium) used a [[channel bonding]] technique (in the case of those boards provided by a [[PLX Technology|PLX]] PEX8608 or PEX8613 PCI Express switch) that combines two PCI Express 2.5&nbsp;GT/s lanes into a single PCI Express 5&nbsp;GT/s lane (among other features), thus obtaining the necessary bandwidth from the PCH.<ref>{{cite web |first=Thomas |last=Soderstrom |url= http://www.tomshardware.com/reviews/usb-3.0-performance,2490-2.html |title=New Motherboards from Asus and Gigabyte&nbsp;– USB 3.0 Performance: Two Solutions from Asus and Gigabyte |work=Tom's Hardware |date=9 December 2009 |access-date=22 January 2014}}</ref><ref>{{cite web |first1=Patrick |last1=Schmid |first2=Achim |last2=Roos |url= http://www.tomshardware.com/reviews/nec-controller-usb-3-pd720200,2682-3.html |title=Gigabyte P55A-UD6 and UD7 (NEC PD720200)&nbsp;– Not All USB 3.0 Implementations Are Created Equal |work=Tom's Hardware |date=26 August 2010 |access-date=22 January 2014}}</ref><ref>PLX model numbers are from the P55A-UD7 manual, page 7 and Asus P7P55D-E Premium manual p. 2-2; the P55A-UD7 has a block diagram on page 8</ref>

==={{Anchor|RF-INTERFERENCE}}Radio frequency interference===
USB&nbsp;3.0 devices and cables may [[RF interference|interfere]] with wireless devices operating in the 2.4&nbsp;GHz ISM band. This may result in a drop in throughput or complete loss of response with [[Bluetooth]] and [[Wi-Fi]] devices.<ref>{{cite web |url= http://www.usb.org/developers/docs/whitepapers/327216.pdf |title=USB 3.0 Radio Frequency Interference Impact on 2.4&nbsp;GHz Wireless Devices |website=USB.org |publisher=USB Implementers Forum |date=April 2012 |access-date=14 October 2019}}</ref> When manufacturers were unable to resolve the interference issues in time, some mobile devices, such as the Vivo Xplay 3S, had to drop support for USB 3.0 just before they shipped.<ref>{{cite web |url= http://m.sohu.com/n/445606397/ |title=手机厂商阉割Type-C接口的真相：影响手机信号！-科技频道-手机搜狐 |trans-title=The Truth About Mobile-Phone Manufacturers Cutting the Type‑C Interface: Affecting Cell Phone Signals! |date=2017 |website=Sohu.com |language=zh}}</ref> Various strategies can be applied to mitigate the problem, ranging from simple solutions, such as increasing the distance of USB&nbsp;3.0 devices from Wi-Fi and Bluetooth devices, to applying additional shielding around internal computer components.<ref>{{cite magazine |last=Lynn |first=Samara |url= https://www.pcmag.com/article2/0,2817,2423604,00.asp |title=Wireless Witch: The Truth About USB 3.0 and Wi-Fi Interference |magazine=[[PC Magazine]] |date=5 September 2013 |access-date=14 July 2014}}</ref>

=={{Anchor|CONNECTORS|MICRO-B}}Connectors==
{{See also|USB hardware#Connectors}}

{{Multiple image
 |direction=vertical
 |image1=USB 3.0 A Buchse 13.jpg
 |image2=USB-3.0-Stecker (Typ B).jpg
 |image3=Connector USB 3 IMGP6033 wp.jpg
 |footer=USB&nbsp;3.0 Standard‑A receptacle (top, in the blue color [[Pantone]] 300&nbsp;C), Standard‑B plug (middle), and Micro‑B plug (bottom)
}}

A USB&nbsp;3.0 Standard‑A receptacle accepts either a USB&nbsp;3.0 Standard‑A plug or a USB&nbsp;2.0 Standard‑A plug. Conversely, it is possible to plug a USB&nbsp;3.0 Standard‑A plug into a USB&nbsp;2.0 Standard‑A receptacle. This is a principle of backward compatibility. The Standard‑A plug is used for connecting to a computer port, at the host side.

A USB&nbsp;3.0 Standard‑B receptacle accepts either a USB&nbsp;3.0 Standard‑B plug or a USB&nbsp;2.0 Standard‑B plug. Backward compatibility applies to connecting a USB&nbsp;2.0 Standard‑B plug into a USB&nbsp;3.0 Standard‑B receptacle. However, it is not possible to plug a USB&nbsp;3.0 Standard‑B plug into a USB&nbsp;2.0 Standard‑B receptacle, due to the physically larger connector. The Standard‑B plug is used at the device side.

Since USB&nbsp;2.0 and USB&nbsp;3.0 ports may coexist on the same machine and they look similar, the USB&nbsp;3.0 specification recommends that the Standard‑A USB&nbsp;3.0 receptacle have a blue insert ([[Pantone]] 300&nbsp;C color). The same color-coding applies to the USB&nbsp;3.0 Standard‑A plug.<ref name="USB 3.0 spec" />{{rp|sections 3.1.1.1 and 5.3.1.3}}

USB&nbsp;3.0 also introduced a new Micro‑B cable plug, which consists of a standard USB 1.x/2.0 Micro‑B cable plug, with an additional 5-pin plug "stacked" beside it. That way, the USB&nbsp;3.0 Micro‑B host receptacle preserves its backward compatibility with the USB 1.x/2.0 Micro‑B cable plug, allowing devices with USB&nbsp;3.0 Micro‑B ports to run at USB&nbsp;2.0 speeds on USB&nbsp;2.0 Micro‑B cables. However, it is not possible to plug a USB&nbsp;3.0 Micro‑B plug into a USB&nbsp;2.0 Micro‑B receptacle, due to the physically larger connector.

==={{Anchor|PINOUTS}}Pin assignments===
{{Multiple image
 |direction=vertical
 |image1=USB 3.0.png
 |image2=USB 3 Pins static.jpg
 |footer=USB&nbsp;3.0 Standard‑A plug (top) and receptacle (bottom), with annotated pins
}}

The connector has the same physical configuration as its predecessor but with five more pins.

The VBUS, D−, D+, and GND pins are required for USB&nbsp;2.0 communication. The five additional USB&nbsp;3.0 pins are two differential pairs and one ground (GND_DRAIN). The two additional differential pairs are for SuperSpeed data transfer; they are used for full duplex SuperSpeed signaling. The GND_DRAIN pin is for drain wire termination and to control EMI and maintain signal integrity.

{| class="wikitable" style="text-align: center; border: none; margin: 1em auto 1em auto;"
|+ USB&nbsp;3.0 connector pin assignments<ref name="usb3_cabledia">{{cite web |title=USB 3.0 Interface Bus, Cable Diagram|url= http://www.interfacebus.com/usb-cable-diagram-30.html}} 100806 interfacebus.com</ref>
|-
! rowspan=2 |Pin
! rowspan=2 |Color
! colspan=2 |Signal name
! rowspan=2 |Description
|-
! A connector
! B connector
|-
|                                            Shell    || {{N/A}} || colspan=2 |Shield || style="text-align: left;" |Metal housing
|-
| 1 
| style="background: red; color: white;" |Red     || colspan=2 |VBUS || style="text-align: left;" |Power
|-
| 2 
| style="background: white;"       |White   || colspan=2 |D− || rowspan=2 style="text-align: left;" |USB&nbsp;2.0 differential pair
|-
| 3 
| style="background: green; color: white;" |Green   || colspan=2| D+
|-
| 4 
| style="background: black; color: white;" |Black   || colspan=2| GND || style="text-align: left;" |Ground for power return
|-
| 5 
| style="background: blue; color: white;" |Blue    || StdA_SSRX− || StdB_SSTX− || rowspan=2 style="text-align: left;" |SuperSpeed receiver differential pair
|-
| 6 
| style="background: yellow;"      |Yellow  || StdA_SSRX+ || StdB_SSTX+
|-
| 7
|                                             {{N/A}} || colspan=2| GND_DRAIN || style="text-align: left;" |Ground for signal return
|-
| 8 
| style="background: purple; color: white;" |Purple  || StdA_SSTX− || StdB_SSRX− || rowspan=2 style="text-align: left;" |SuperSpeed transmitter differential pair
|-
| 9 
| style="background: orange;"      |Orange  || StdA_SSTX+ || StdB_SSRX+
|-
! colspan="5"| The USB&nbsp;3.0 ''Powered‑B'' connector has two additional pins for power and ground supplied to the device.<ref>{{cite web |url= http://www.totalphase.com/support/articles/200349256-USB-Background#s1.1.3.2 |title=USB Background |work=TotalPhase.com |publisher=Total Phase Corporation |access-date=11 September 2016 |quote=USB 3.0 includes a variant of the Standard‑B connectors which has two additional conductors to provide power to USB adapters. Image courtesy of USB Implementers Forum}}</ref>
|-
| 10
| colspan=2 rowspan=2 {{N/A}}              || DPWR || style="text-align: left;" |Power provided to device (Powered‑B&nbsp;only)
|-
| 11
|                                                      DGND || style="text-align: left;" |Ground for DPWR return (Powered‑B&nbsp;only)
|}

==={{Anchor|BACKWARD-COMPATIBILITY}}Backward compatibility===
[[File:USB Micro-B USB 2.0 vs USB Micro-B SuperSpeed (USB 3.0) - Copy.jpg|thumb|USB Micro‑B USB 2.0 vs USB Micro‑B SuperSpeed (USB 3.0)]]
USB&nbsp;3.0 and USB&nbsp;2.0 (or earlier) Type‑A plugs and receptacles are designed to interoperate.

USB&nbsp;3.0 Type‑B receptacles, such as those found on peripheral devices, are larger than in USB&nbsp;2.0 (or earlier versions), and accept both the larger USB&nbsp;3.0 Type‑B plug and the smaller USB&nbsp;2.0 (or earlier) Type‑B plug. USB&nbsp;3.0 Type‑B plugs are larger than USB&nbsp;2.0 (or earlier) Type‑B plugs; therefore, USB&nbsp;3.0 Type‑B plugs cannot be inserted into USB&nbsp;2.0 (or earlier) Type‑B receptacles.

Micro USB&nbsp;3.0 (Micro‑B) plug and receptacle are intended primarily for small portable devices such as smartphones, digital cameras and GPS devices. The Micro USB&nbsp;3.0 receptacle is backward compatible with the Micro USB&nbsp;2.0 plug.

A receptacle for [[eSATAp]], which is an eSATA/USB combo, is designed to accept USB Type‑A plugs from USB&nbsp;2.0 (or earlier), so it also accepts USB&nbsp;3.0 Type‑A plugs.

{{clear}}

=={{anchor|3.1}}USB 3.1==
[[File:Certified SuperSpeed Plus USB 10 Gbps Logo.svg|thumb|A deprecated<ref name="USB-IF Licensed Mark(s) Requirements"/> SuperSpeed+ USB 10&nbsp;Gbit/s packaging logo]]
In January 2013 the USB group announced plans to update USB 3.0 to 10&nbsp;Gbit/s (1250&nbsp;MB/s).<ref>{{Cite press release|url= http://www.usb.org/press/USB-IF_Press_Releases/SuperSpeed_10Gbps_USBIF_Final.pdf |title=SuperSpeed USB (USB 3.0) Performance to Double with New Capabilities |work=Implementers Forum |date=6 January 2013 |url-status=dead |archive-url= https://web.archive.org/web/20130113222037/http://www.usb.org/press/USB-IF_Press_Releases/SuperSpeed_10Gbps_USBIF_Final.pdf |archive-date=13 January 2013}}</ref> The group ended up creating a new USB specification, USB&nbsp;3.1, which was released on 31 July 2013,<ref name="ReferenceC">{{cite press release |title=SuperSpeed USB 10 Gbps&nbsp;– Ready for Development|date=July 31, 2013 |location=Hillsboro, Oregon |url= http://www.usb.org/press/USB-IF_Press_Releases/SuperSpeedUSB_10Gbps_Available_20130731.pdf |archive-url= https://web.archive.org/web/20160127094452/http://www.usb.org/press/USB-IF_Press_Releases/SuperSpeedUSB_10Gbps_Available_20130731.pdf |archive-date=27 January 2016}}</ref> replacing the USB 3.0 standard. The USB 3.1 specification takes over the existing USB 3.0's ''SuperSpeed USB'' transfer rate, now referred to as ''USB 3.1 Gen 1'', and introduces a faster transfer rate called ''SuperSpeed USB 10&nbsp;[[Gbit/s|Gbps]]'', corresponding to operation mode ''USB 3.1 Gen 2'',<ref name="3.1 SLUG" /> putting it on par with a single first-generation [[Thunderbolt (interface)|Thunderbolt]] channel. The new mode's logo features a caption stylized as ''SUPERSPEED+'';<ref name="LUG">{{Cite web |url=https://www.usb.org/sites/default/files/usb-if_logo_usage_guidelines_final_as_of_november_30_2018_locked.pdf |title=USB Logo Usage Guideline |date=30 November 2018 |work=USB.org |publisher=USB Implementers Forum |access-date=27 February 2019 |archive-date=28 February 2019 |archive-url=https://web.archive.org/web/20190228130357/https://www.usb.org/sites/default/files/usb-if_logo_usage_guidelines_final_as_of_november_30_2018_locked.pdf |url-status=dead }}</ref> this refers to the updated ''SuperSpeedPlus'' protocol. The USB&nbsp;3.1 Gen&nbsp;2 mode also reduces line encoding overhead to just 3% by changing the [[encoding scheme]] to [[128b/132b]], with raw data rate of 1,212&nbsp;MB/s.<ref>{{cite web |url= http://www.heraldonline.com/2013/07/31/5071745/superspeed-usb-10-gbps-ready-for.html |title=SuperSpeed USB 10&nbsp;Gbps&nbsp;– Ready for Development |work=Rock Hill Herald |access-date=31 July 2013 |url-status=dead |archive-url= https://web.archive.org/web/20141011015741/http://www.heraldonline.com/2013/07/31/5071745/superspeed-usb-10-gbps-ready-for.html |archive-date=11 October 2014}}</ref> The first USB&nbsp;3.1 Gen 2 implementation demonstrated real-world transfer speeds of 7.2&nbsp;Gbit/s.<ref>{{cite press release|title=Synopsys Demonstrates Industry's First SuperSpeed USB 10&nbsp;Gbps Platform-to-Platform Host-Device IP Data Transfer|url= http://news.synopsys.com/2013-12-10-Synopsys-Demonstrates-Industrys-First-SuperSpeed-USB-10-Gbps-Platform-to-Platform-Host-Device-IP-Data-Transfer|location=[[Mountain View, California]] |work=News.Synopsis.com |publisher=[[Synopsys]] |date=10 December 2013 |access-date=23 December 2013 |quote=As measured by the Ellisys USB Explorer Protocol Analyzer, the IP realized 10&nbsp;[[Gbit/s|Gbps]] USB 3.1 nominal data rates of more than 900&nbsp;[[MB/s|MBps]] between two Synopsys HAPS-70 FPGA-based prototyping systems while using backward compatible USB connectors, cables and software.}}</ref>

The USB&nbsp;3.1 specification includes the USB 2.0 specification while fully preserving its dedicated physical layer, architecture, and protocol in parallel. USB&nbsp;3.1 specification defines the following operation modes:

* ''USB&nbsp;3.1 Gen&nbsp;1'' – newly marketed as ''SuperSpeed or SS'', 5&nbsp;Gbit/s signaling rate over 1 lane using 8b/10b encoding (raw data rate: 500&nbsp;MB/s); replaced ''USB 3.0''.
* ''USB&nbsp;3.1 Gen&nbsp;2'' – new, marketed as ''SuperSpeed+ or SS+'', 10&nbsp;Gbit/s signaling rate over 1 lane using 128b/132b encoding (raw data rate: 1212&nbsp;MB/s).

The nominal data rate in bytes accounts for bit-encoding overhead. The physical SuperSpeed signaling bit rate is 5&nbsp;Gbit/s. Since transmission of every byte takes 10 bit times, the raw data overhead is 20%, so the raw byte rate is 500&nbsp;MB/s, not 625. Similarly, for Gen&nbsp;2 link the encoding is 128b/132b, so transmission of 16 bytes physically takes 16.5 bytes, or 3% overhead. Therefore, the new raw byte-rate is 128/132 * 10&nbsp;Gbit/s = 9.697&nbsp;Gbit/s = 1212&nbsp;MB/s. In reality any operation mode has additional link management and protocol overhead, so the best-case achievable data rates for the Gen&nbsp;2 operation mode are of roughly below 800&nbsp;MB/s for reading bulk transfers only.<ref>[https://www.everythingusb.com/ssd.html Real-World USB 3.2 Gen 2×1 throughput] Everything USB, October 2022</ref><ref name="USB 3.2 spec 1.0"/>

The re-specification of USB&nbsp;3.0 as "USB&nbsp;3.1 Gen&nbsp;1" was misused by some manufacturers to advertise products with signaling rates of only 5&nbsp;Gbit/s as "USB&nbsp;3.1" by omitting the defining generation.<ref name="ars-2019-32">{{cite web |last1=Bright |first1=Peter |title=USB 3.2 is going to make the current USB branding even worse |url= https://arstechnica.com/gadgets/2019/02/usb-3-2-is-going-to-make-the-current-usb-branding-even-worse/ |work=[[Ars Technica]] |date=26 February 2019 |access-date=27 February 2019}}</ref>

=={{anchor|3.2}}USB 3.2==
[[File:Certified SuperSpeed Plus USB 20 Gbps Logo.svg|thumb|A deprecated<ref name="USB-IF Licensed Mark(s) Requirements">
{{cite web
| url = https://www.usb.org/logo-license
| title = USB-IF Licensed Mark(s) Requirements
| publisher = USB Implementers Forum
| date = 20 September 2023
| access-date = 29 August 2023
| archive-url = https://web.archive.org/web/20230921015422/https://www.usb.org/logo-license
| archive-date = 21 September 2023
| last1 = USB Implementers Forum
}}</ref> SuperSpeed+ USB 20&nbsp;Gbit/s packaging logo]]
[[File:USB 20Gbps logo.svg|thumb|USB 20Gbit/s port logo]]
On 25 July 2017, a press release from the USB&nbsp;3.0 Promoter Group detailed a pending update to the [[USB-C|USB Type‑C]] specification, defining the doubling of bandwidth for existing USB‑C cables. Under the USB 3.2 specification, released 22 September 2017,<ref name="USB 3.2 spec 1.0">{{cite web |url= https://www.usb.org/document-library/usb-32-specification-released-september-22-2017-and-ecns |title=USB 3.2 Specification|date=September 2017 |work=USB.org |publisher=[[USB Implementers Forum]] |access-date=14 October 2019|version=1.0}}</ref> existing SuperSpeed certified USB‑C&nbsp;3.1 Gen&nbsp;1 cables will be able to operate at 10&nbsp;Gbit/s (up from 5&nbsp;Gbit/s), and SuperSpeed+ certified USB‑C&nbsp;3.1 Gen&nbsp;2 cables will be able to operate at 20&nbsp;Gbit/s (up from 10&nbsp;Gbit/s). The increase in bandwidth is a result of multi-lane operation over existing wires that were intended for flip-flop capabilities of the USB‑C connector.<ref>{{Cite press release |url= http://www.usb.org/press/USB_3.2_PR_USB-IF_Final.pdf |title=USB 3.0 Promoter Group Announces USB 3.2 Update |last1=Saunders |first1=Brad |last2=Nardozza |first2=Liz |date=25 July 2017 |via=USB.org |publisher=USB 3.0 Promoter Group |access-date=27 July 2017 |archive-url= https://web.archive.org/web/20170921191940/http://www.usb.org/press/USB_3.2_PR_USB-IF_Final.pdf |archive-date=21 September 2017 |url-status=dead}}</ref><ref>{{Cite news |url= https://arstechnica.com/gadgets/2017/07/usb-3-2-will-make-your-cables-twice-as-fast-once-youve-bought-new-devices/ |title=USB 3.2 will make your cables twice as fast ... once you've bought new devices |last=Bright |first=Peter |date=26 July 2017 |work=[[Ars Technica]] |access-date=27 July 2017}}</ref>

The USB&nbsp;3.2 standard includes the USB 2.0 specification with four dedicated wires on the physical layer. The '''Enhanced SuperSpeed System''' encompasses both, but separated – and in parallel to the USB&nbsp;2.0 implementation:<ref name="USB 3.2 spec 1.0" />{{rp|at=Figure 3-2}}
*'''SuperSpeed USB''' (based on ''SuperSpeed'' architecture and protocols):
**'''USB&nbsp;3.2 Gen&nbsp;1×1''' – newly marketed as ''SuperSpeed USB 5Gbps'' (replaces ''SuperSpeed or SS''), 5&nbsp;Gbit/s signaling rate over 1 lane using 8b/10b encoding (raw data rate: 500&nbsp;MB/s); replaces ''USB&nbsp;3.1 Gen&nbsp;1'', which replaced ''USB&nbsp;3.0''.
*'''SuperSpeedPlus USB''' (based on ''SuperSpeedPlus'' architecture and protocols):
**'''USB&nbsp;3.2 Gen&nbsp;2×1''' – newly marketed as ''SuperSpeed USB 10&nbsp;Gbps'' (replaces ''SuperSpeed+ or SS+''),<ref name="LUG" /> 10 Gbit/s signaling rate over 1 lane using 128b/132b encoding (raw data rate: 1212&nbsp;MB/s); replaces USB&nbsp;3.1 Gen&nbsp;2.
**'''USB&nbsp;3.2 Gen&nbsp;1×2''' – '''new''', 10&nbsp;Gbit/s signaling rate over 2 lanes using 8b/10b encoding (raw data rate: 1000&nbsp;MB/s).
**'''USB&nbsp;3.2 Gen&nbsp;2×2''' – '''new''', marketed as ''SuperSpeed USB 20&nbsp;Gbps'', 20&nbsp;Gbit/s signaling rate over 2 lanes using 128b/132b encoding (raw data rate: 2424&nbsp;MB/s).

As with the previous version, the same considerations around encoding and raw data rates apply. Although both Gen&nbsp;1×2 and Gen&nbsp;2(×1) signal at 10&nbsp;Gbit/s, Gen&nbsp;1×2 uses the older, less efficient 8b/10b line coding which results in a lower raw data rate compared with Gen&nbsp;2(×1), though both using the newer SuperSpeedPlus protocol.<ref name="USB 3.2 spec 1.0" />{{rp|at=Figure 3-2}}

In May 2018, [[Synopsys]] demonstrated the first USB&nbsp;3.2 Gen&nbsp;2×2 operation mode, where a Windows PC was connected to a storage device, reaching an average data rate of 1600&nbsp;MB/s for reading bulk transmissions,<ref name="Synopsis demo">{{Cite news |url= https://www.tomshardware.com/news/usb-3.2-synopsys-20gbps,37124.html |title=Synopsys Shows World's First USB 3.2 Demo With 20Gbps Speeds |date=25 May 2018 |work=Tom's Hardware |access-date=27 May 2018}}</ref><ref name="1st demo">{{cite web |publisher=[[Synopsys]] |via=YouTube |title=World's First USB 3.2 Demonstration |date=18 May 2018 |url= https://www.youtube.com/watch?v=WPUvHeq_Sgs | archive-url=https://ghostarchive.org/varchive/youtube/20211117/WPUvHeq_Sgs| archive-date=2021-11-17 | url-status=live|access-date=27 May 2018}}{{cbignore}}</ref> which is 66% of its raw throughput.

USB&nbsp;3.2 is supported with the default Windows 10 USB drivers and in Linux kernels 4.18 and onwards.<ref name="Synopsis demo" /><ref name="1st demo" /><ref>{{Cite web |url= https://www.phoronix.com/scan.php?page=news_item&px=USB-3.2-Linux-4.18-Next |title=USB 3.2 Work Is On the Way for the Linux 4.18 Kernel |publisher=[[Phoronix]] |work=Phoronix.com |access-date=27 May 2018}}</ref>

In February 2019, USB-IF simplified the marketing guidelines by excluding Gen&nbsp;1×2 mode and required the SuperSpeed trident logos to include maximum transfer speed.<ref>{{Cite web|url=https://www.theverge.com/circuitbreaker/2019/2/27/18243425/usb-3-2-standard-names-connectivity-cables-innovators-forum|title = USB 3.2 standard gets new, even more confusing names ahead of its mainstream debut|date = 27 February 2019}}</ref><ref name="3.2 SLUG" />

Two-lane operation (USB&nbsp;3.2 Gen&nbsp;1×2, USB&nbsp;3.2 Gen&nbsp;2×2) is only possible with Full-Featured Type‑C connectors.<ref name=USBC22>{{cite tech report |url=https://www.usb.org/document-library/usb-type-cr-cable-and-connector-specification-release-22 |title=Universal Serial Bus Type‑C Cable and Connector Specification, Release 2.2 |work=USB Implementers Forum |date=October 2022 |institution=USB 3.0 Promoter Group |access-date=2023-04-12}}</ref>

{{mw-datatable}}
{| class="wikitable sortable mw-datatable" style="text-align:center;"
|+USB 3.2 specification operation modes
![[USB Implementers Forum|USB-IF]] recommended<br />marketing name<ref name="usb.org"/>
!Logo<ref name="new_and_deprecated_logos-2023" />
! USB 3.2 specification operation mode<ref name="USB 3.2 spec 1.0"/>
!Older operation mode names<br />(''first publication'')<ref name="USB 3.0 spec"/><ref name="USB 3.1 spec"/>
!Dual lane
![[Line code|Encoding]]
!Nominal signal rate<ref name="USB 3.2 spec 1.0"/>
!Raw data rate<ref name="USB 3.2 spec 1.0"/>
!Measured real-world throughput<ref>[https://www.everythingusb.com/speed.html Real-world USB 3.2 throughput] Everything USB, February 2022</ref>
![[USB#Connector type quick reference|Supporting connectors]]<ref>{{Cite web |url=https://usb.org/document-library/usb-31-legacy-connectors-and-cable-assemblies-compliance-document-rev-11 |title=USB 3.1 Legacy Connectors and Cable Assemblies Compliance Document Rev 1.1 |work=USB.org |publisher=USB Implementers Forum |access-date=27 February 2019 |archive-date=28 February 2019 |archive-url=https://web.archive.org/web/20190228130325/https://usb.org/document-library/usb-31-legacy-connectors-and-cable-assemblies-compliance-document-rev-11 |url-status=dead }}</ref>
|-
<!-- Please do not change units to "Gbit/s", these are verbatim marketing names specified by the USB Implementers Forum -->
|SuperSpeed USB 5Gbps
|[[File:USB 5Gbps logo.svg|50px]]
| USB&nbsp;3.2 Gen&nbsp;1×1
|USB&nbsp;3.0,<br />USB&nbsp;3.1 Gen&nbsp;1<br />(''USB&nbsp;3.0'')
| rowspan=2 {{No}}
|[[8b/10b encoding|8b/10b]]
|5 Gbit/s  
|0.5 GB/s
|≤ 0.45&nbsp;GB/s
| rowspan=2 | {{nowrap|SS Standard-[A, B]}}, {{nowrap|SS Micro-[A, B, AB]}}, {{nowrap|C}}
|-
| SuperSpeed USB 10Gbps 
| rowspan=2 | [[File:USB 10Gbps logo.svg|50px]]
| USB&nbsp;3.2 Gen&nbsp;2×1
|USB&nbsp;3.1 Gen&nbsp;2<br />(''USB&nbsp;3.1'')
|[[128b/132b]]
| rowspan=2 | 10 Gbit/s
|1.2 GB/s
|≤ 0.8&nbsp;GB/s
|-
|{{n/a}}
| USB&nbsp;3.2 Gen&nbsp;1×2
| rowspan=2 | —<br />(''USB&nbsp;3.2'')
| rowspan=2 {{Yes}}
|8b/10b
|1 GB/s
|≤ 0.70&nbsp;GB/s
| rowspan=2 | C
|-
|SuperSpeed USB 20Gbps
|[[File:USB 20Gbps logo.svg|50px]]
| USB&nbsp;3.2 Gen&nbsp;2×2
|128b/132b
|20 Gbit/s
|2.4 GB/s
|≤ 1.6&nbsp;GB/s
|}

==See also==
{{Portal|Electronics}}

* [[USB4]]
*[[Bus (computing)|Computer bus]]
* [[Extensible Host Controller Interface]] (XHCI)
* {{section link|List of device bit rates|Peripheral}}
* [[Mobile High-Definition Link]]
* {{section link|USB hardware|Host and device interface receptacles}}

==References==
{{Reflist|30em}}

==External links==
{{Commons category}}
* {{cite web|url=http://blog.laptopmag.com/usb-big-changes-2014|title=Supreme Port: 4 Huge Changes Coming to USB|work=LaptopMag.com|date=16 January 2014}}{{snd}} CES 2014 report of a laptop docking port using a single USB 3.1 port to supply power, video and USB peripherals

{{USB}}
{{DC power delivery standards}}
{{Computer-bus}}
{{Basic computer components}}

[[Category:USB|#3.0]]
[[Category:Computer-related introductions in 2008]]