View source for System in a package

{{Short description|Electronic component}}
{{Refimprove|date=February 2014}}
[[File:System in package.png|thumb|CAD drawing of a SiP multi-chip which contains a processor, memory and storage on a single substrate]]
A '''system in a package''' ('''SiP''') or '''system-in-package''' is a number of [[integrated circuit]]s (ICs) enclosed in one  [[chip carrier]] package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using [[package on package]], placed side by side, and/or embedded in the substrate.<ref>[https://thor.inemi.org/webdownload/Industry_Forums/Productronica_2005/Floor_Pres/SIP.pdf INEMI System in Package Technology], ''thor.inemi.org,'' June 2005, Retrieved 2024-01-24</ref> The SiP performs all or most of the functions of an [[electronic system]], and is typically used when [[Integrated circuit design|designing]] components for [[mobile phone|mobile phones]], [[Portable media player|digital music players]], etc.<ref> By Pushkar Apte, W. R. Bottoms, William Chen and George Scalise, IEEE Spectrum. “[https://spectrum.ieee.org/advanced-chip-packaging-satisfies-smartphone-needs Advanced Chip Packaging Satisfies Smartphone Needs].” February 8, 2011. Retrieved July 31, 2015.</ref> [[die (integrated circuit)|Die]]s containing integrated circuits may be stacked vertically on the package substrate. They are internally connected by fine [[wire]]s that are bonded to the package substrate. Alternatively, with a [[flip chip]] technology, solder bumps are used to join stacked chips together and to the package substrate, or even both techniques can be used in a single package. SiPs are like [[system on a chip|systems on a chip]] (SoCs) but less tightly integrated and not on a single [[Die (integrated circuit)|semiconductor die]].<ref>[https://anysilicon.com/system-in-package-sip-a-success-story/ System-in-Package (SiP), a success story] // AnySilicon, February 21, 2020</ref> 

SIPs can be used either to reduce the size of a system, improve performance or to reduce costs.<ref>{{cite web | url=https://anysilicon.com/system-in-package-sip-a-success-story/ | title=System-in-Package (SiP), a success story | date=21 February 2020 }}</ref><ref>{{cite web | url=https://pocketnow.com/iwatch-system-in-package/ | title=Here's why System-in-Package is a big deal for Apple's upcoming iWatch, and everything else | date=30 April 2014 }}</ref> The technology evolved from multi chip module (MCM) technology, the difference being that SiPs also use [[Three-dimensional integrated circuit|die stacking]], which stacks several chips or dies on top of each other.<ref>{{cite web | url=https://www.3dincites.com/2017/08/mcm-sip-soc-and-heterogeneous-integration-defined-and-explained/ | title=MCM, SiP, SoC, and Heterogeneous Integration Defined and Explained | date=7 August 2017 }}</ref><ref name="auto">{{cite web | url=https://semiwiki.com/eda/cadence/272958-sip-is-the-new-soc-56th-dac/ | title=SiP is the new SoC @ 56thDAC | date=21 February 2024 }}</ref>

== Technology ==
SiP dies can be stacked vertically or tiled horizontally, with techniques like [[Chiplet|chiplets]] or [[quilt packaging]]. SiPs connect the dies with standard off-chip [[Wire bonding|wire bonds]] or solder bumps, unlike slightly denser [[three-dimensional integrated circuit]]s which connect stacked silicon dies with conductors running through the die using [[through-silicon via]]s. Many different 3D packaging techniques have been developed for stacking many fairly standard chip dies into a compact area.<ref>By R. Wayne Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. “[http://nepp.nasa.gov/docuploads/EA7E7EA1-BD30-4DA4-BD615FEA1A7F5AE9/3D%20Packaging%20Report%20071805.pdf 3-D Packaging: A Technology Review].” June 23, 2005. Retrieved July 31, 2015.</ref>

SiPs can contain several chips or dies&mdash;such as a specialized [[Central processing unit|processor]], [[DRAM]], [[flash memory]]&mdash;combined with [[passive components]]&mdash;[[resistor]]s and [[capacitor]]s&mdash;all mounted on the same [[Substrate (electronics)|substrate]]. This means that a complete functional unit can be built in a single package, so that few external components need to be added to make it work. This is particularly valuable in space constrained environments like [[MP3 player|MP3 players]] and [[Mobile phone|mobile phones]] as it reduces the complexity of the [[printed circuit board]] and overall design. Despite its benefits, this technique decreases the yield of fabrication since any defective chip in the package will result in a non-functional packaged integrated circuit, even if all other modules in that same package are functional.

SiPs are in contrast to the common system on a chip (SoC) integrated circuit architecture which integrates components based on function into a single [[Die (integrated circuit)|circuit die]]. An SoC will typically integrate a CPU, [[Graphics processing unit|graphics]] and memory interfaces, [[Hard disk drive|hard-disk]] and [[USB]] connectivity, [[random-access memory|random-access]] and [[read-only memory|read-only]] [[computer memory|memories]], and secondary storage and/or their controllers on a single die. In comparison an SiP would connect these modules as [[discrete components]] in one or more chip packages or dies. An SiP resembles the common traditional [[motherboard]]-based [[Personal computer|PC]] [[Computer architecture|architecture]], as it separates components based on function and connects them through a central interfacing circuit board. An SiP has a lower grade of integration in comparison to an SoC. Hybrid integrated circuits (HICs) are somewhat similar to SiPs, however they tend to handle analog signals<ref>{{cite web | url=https://www.pcmag.com/encyclopedia/term/hybrid-microcircuit | title=Definition of hybrid microcircuit }}</ref> whereas SiPs usually handle digital signals,<ref>{{cite web | url=https://www.anandtech.com/show/9381/the-apple-watch-review/3 | title=The Apple Watch Review }}</ref><ref>{{cite web | url=https://www.ifixit.com/Teardown/Apple+Watch+Teardown/40655 | title=Apple Watch Teardown | date=23 April 2015 }}</ref><ref>{{cite web | url=https://appleinsider.com/articles/15/05/07/analysis-of-apple-watchs-s1-chip-reveals-30-individual-components-in-very-unique-package/amp/ | title=Analysis of Apple Watch's S1 chip reveals 30 individual components in 'very unique' package | date=7 May 2015 }}</ref><ref>{{Cite web|url=https://www.allaboutcircuits.com/technical-articles/introduction-to-microelectromechanical-systems-microphone-technology/|title=Introduction to MEMS Microphone Technology—Analog vs Digital Microphones - Technical Articles}}</ref><ref> All components in the Apple S1 SIP have digital interfaces for example amplifiers, the STM32 microcontroller, gyroscopes, MEMS microphones, power management ICs, NFC chips which can be seen by looking at their datasheets or datasheets of similar products from the same manufacturers like https://www.analog.com/media/en/technical-documentation/data-sheets/MAX98390.pdf https://www.renesas.com/us/en/document/dst/da9080-datasheet https://www.st.com/resource/en/datasheet/lsm6dsox.pdf www.sensors.ch/doc/wearables_eloy_markets.pdf 
 www.alldatasheet.com/datasheet-pdf/pdf/1132058/BOARDCOM/BCM4334X.html</ref> because of this HICs use older or less advanced technology (tend to use single layer circuit boards or substrates, not use die stacking, do not use flip chip or BGA for connecting components or dies, use only wire bonding for connecting dies or Small outline integrated circuit packages, use Dual in-line packages, or Single in-line packages for interfacing outside the Hybrid IC instead of BGA, etc.).<ref>{{Cite journal |last1=Ko |first1=Cheng-Ta |last2=Yang |first2=Henry |last3=Lau |first3=John |last4=Li |first4=Ming |last5=Li |first5=Margie |last6=Lin |first6=Curry |last7=Lin |first7=J. W. |last8=Chang |first8=Chieh-Lin |last9=Pan |first9=Jhih-Yuan |last10=Wu |first10=Hsing-Hui |last11=Chen |first11=Yu-Hua |last12=Chen |first12=Tony |last13=Xu |first13=Iris |last14=Lo |first14=Penny |last15=Fan |first15=Nelson |date=2018-10-01 |title=Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration |url=https://jmep.scholasticahq.com/article/40215 |journal=Journal of Microelectronics and Electronic Packaging |language=en |volume=15 |issue=4 |pages=141–147 |doi=10.4071/imaps.734552 |s2cid=226940879 |issn=1551-4897|url-access=subscription }}</ref>

SiP technology is primarily being driven by early market trends in [[Wearable computer|wearables]], mobile devices and the [[internet of things]] which do not demand the high numbers of produced units as in the established consumer and business SoC market. As the internet of things becomes more of a reality and less of a vision, there is innovation going on at the system on a chip and SiP level so that [[Microelectromechanical systems|microelectromechanical]] (MEMS) sensors can be integrated on a separate die and control the connectivity.<ref>By Ed Sperling, Semiconductor Engineering. “[http://semiengineering.com/why-packaging-matters/ Why Packaging Matters].” November 19, 2015. Retrieved March 16, 2016.</ref> 

SiP solutions may require multiple [[Integrated circuit packaging|packaging]] technologies, such as [[flip chip]], [[wire bonding]], [[wafer-level packaging]], [[Through-silicon via]]s (TSVs), chiplets and more.<ref>By Tech Search International and Chip Scale Review Staff, Chip Scale Review. “[http://fbs.advantageinc.com/chipscale/may-jun_2016/files/assets/basic-html/page-1.html Major OSATs positioned for growth opportunities in SiP].” May/June Issue. Retrieved June 22, 2016.</ref><ref name="auto"/>

== Suppliers ==
{{div col}}
* [[Advanced Micro Devices]]
* [[Amkor Technology]]
* [[Atmel]]
* AMPAK Technology Inc.
* NANIUM, S.A.
* [[ASE Group]]
* CeraMicro
* ChipSiP Technology
* [[Cypress Semiconductor]]
* STATS ChipPAC Ltd
* [[Toshiba]]
* [[Renesas]]
* [[SanDisk]]
* [[Samsung]]
* [[Silicon Labs]]
* Octavo Systems
* [[Nordic Semiconductor]]
* JCET
* [[Desay Sip]]
* [[Universal Scientific Industrial]] (USI)
{{div col end}}

==See also==
* [[Advanced packaging (semiconductors)]]
* [[Multi-chip module]]
* [[System on a chip]] (SoC)
* [[Hybrid integrated circuit]] (HIC)

== References ==
{{reflist}}
{{System on a chip}}
[[Category:Packaging (microfabrication)]]
[[Category:Integrated circuits]]
[[Category:Electronic design]]
[[Category:Microtechnology]]
[[Category:Computer systems]]